H05K 1/0209
External configuration of printed circuit board adapted for heat dissipation
Official title: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings}
H05K1/0209 (External configuration of printed circuit board adapted for heat dissipation) appears on 1,063 US grants and 1,351 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,063
- Published applications
- 1,351
- Assignees
- 675
- Inventors
- 3,020
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 5 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 14 | 3 |
| 2002 | 6 | 4 |
| 2003 | 5 | 7 |
| 2004 | 4 | 16 |
| 2005 | 7 | 8 |
| 2006 | 6 | 17 |
| 2007 | 7 | 23 |
| 2008 | 5 | 13 |
| 2009 | 5 | 20 |
| 2010 | 10 | 19 |
| 2011 | 14 | 23 |
| 2012 | 12 | 23 |
| 2013 | 16 | 36 |
| 2014 | 24 | 75 |
| 2015 | 39 | 85 |
| 2016 | 68 | 89 |
| 2017 | 78 | 86 |
| 2018 | 82 | 96 |
| 2019 | 97 | 114 |
| 2020 | 90 | 105 |
| 2021 | 82 | 100 |
| 2022 | 84 | 89 |
| 2023 | 87 | 94 |
| 2024 | 83 | 88 |
| 2025 | 64 | 58 |
| 2026 | 39 | 60 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
- Signal light unit having heat dissipating function456US 4,729,076 A1988
- Lighting units429US 5,890,794 A1999
- Semiconductor package280US 8,921,990 B2Samsung Electronics Co., Ltd. · 2014
- High power radiation emitter device and heat dissipating package for electronic components249US 6,639,360 B2Gentex Corporation · 2003
- Light emitting apparatus128US 7,345,320 B22008