H05K 1/0212
Printed circuits or mounted components having integral heating means
Official title: {Printed circuits or mounted components having integral heating means}
H05K1/0212 (Printed circuits or mounted components having integral heating means) appears on 337 US grants and 385 published applications in this corpus.
Search patents in H05K- Granted patents
- 337
- Published applications
- 385
- Assignees
- 258
- Inventors
- 872
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 0 |
| 2002 | 4 | 9 |
| 2003 | 5 | 3 |
| 2004 | 4 | 11 |
| 2005 | 8 | 9 |
| 2006 | 6 | 11 |
| 2007 | 2 | 7 |
| 2008 | 6 | 10 |
| 2009 | 5 | 8 |
| 2010 | 6 | 9 |
| 2011 | 7 | 3 |
| 2012 | 3 | 3 |
| 2013 | 8 | 10 |
| 2014 | 2 | 12 |
| 2015 | 6 | 27 |
| 2016 | 13 | 18 |
| 2017 | 21 | 34 |
| 2018 | 24 | 22 |
| 2019 | 32 | 33 |
| 2020 | 26 | 28 |
| 2021 | 16 | 22 |
| 2022 | 13 | 27 |
| 2023 | 19 | 19 |
| 2024 | 20 | 22 |
| 2025 | 22 | 17 |
| 2026 | 10 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device29 Sep 2026US 12,750,946 B2Kmw Inc.
- Universal housing for pluggable network interface devices21 Jul 2026US 12,689,164 B2Mellanox Technologies, Ltd.
- Heat sink component with land grid array connections26 May 2026US 12,641,758 B2KYOCERA AVX Components Corporation
- Programmable circuit board and method of use19 May 2026US 12,635,069 B2Itera, Inc.
- Microfluidic printed circuit board cooling21 Apr 2026US 12,610,452 B2Microsoft Technology Licensing, LLC
- Microfluidic printed circuit board cooling8 Oct 2026US 2026/0313782 A1Microsoft Technology Licensing, LLC
- Component Carrier With Porous Body, and Manufacture Method1 Oct 2026US 2026/0304615 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- High density connector for superconducting applications20 Aug 2026US 2026/0246213 A1IQM Finland Oy
- Contacting circuit board30 Jul 2026US 2026/0221542 A1Hoppecke Systemtechnik GmbH
- Sensor arrangement with integrated electronics2 Jul 2026US 2026/0185857 A1Volkswagen Aktiengesellschaft
Most cited
By later US patents
- Self regulating temperature heater as an integral part of a printed circuit board90US 5,010,233 AAMP Incorporated · 1991
- Laminated board for testing electronic components69US 4,978,914 AFurukawa Denki Kogyo Kabushiki Kaisha · 1990
- Integral heater for reworking MCMS and other semiconductor components68US 6,031,729 ATRW Inc. · 2000
- Circuit board/printed circuit board having pre-reserved conductive heating circuits64US 6,541,736 B1Usun Technology Co., Ltd. · 2003
- Method of self-assembly on a surface62US 7,774,929 B2Regents of the University of Minnesota · 2010