Microfluidic printed circuit board cooling

A method of manufacturing a microfluidic printed circuit board (PCB) comprising:

• providing a top layer including a top network of traces;
• attaching a first mid-layer including a first middle network of traces;
• attaching a second mid-layer including a second middle network of traces;
• attaching a bottom layer including a bottom network of traces, wherein the top layer, the first mid-layer, the second mid-layer, and the bottom layer are each one of a ground layer, a power layer, and a signal layer;
• attaching a heat-generating component to the microfluidic PCB;
• and
• forming a network of microfluidic passages in one or more of the ground layer, the power layer, and the signal layer and in thermally conductive contact with the heat-generating component, the network of microfluidic passages being electrically isolated from the top network of traces, the first middle network of traces, the second middle network of traces, and bottom network of traces.

A printed circuit board comprising:

• a ground layer including a first network of traces;
• a power layer including a second network of traces;
• a signal layer including a third network of traces;
• a heat-generating component attached to the printed circuit board;
• a closed-loop network of microfluidic passages formed in one or more of the ground layer, the power layer, and the signal layer and in thermally conductive contact with the heat-generating component, the network of microfluidic passages being electrically isolated from the first network of traces, the second network of traces, and the third network of traces;
• and
• a microfluidic pump placed within the closed-loop network and attached to the printed circuit board, the microfluidic pump to circulate a coolant fluid through the network of microfluidic passages to cool the heat-generating component.