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AssigneeTRW Inc.
InventorsRyan S. Berkely, Mary C. Massey, William E. McMullen, III, Steven F. VanLiew
Estimating the term…
A multi-chip module or other electronic semiconductor component (1) contains a multi-layer substrate (9) whose bottom surface, the bottom of the bottom layer (15) of that substrate, serves as the bonding surface for bonding the multi-chip module or component to a printed wiring board (8) using a thermally sensitive adhesive, such as a thermally sensitive adhesive or solder. The bottom layer (15) of that multi-layer substrate integrally includes a plurality of electrical heaters (16-28), arranged side by side. When energized with appropriate current, the heater generates sufficient heat to weaken the adhesive bond, allowing the MCM to be pulled away from the printed wiring board and removed, without weakening the bonding of the multiple layers of the laminate substrate or weakening the MCM component's bond to that substrate.
In a multi-chip module, said module comprising a plurality of semiconductor chips, a multi-layer substrate of a high temperature co-fired ceramic for supporting said semiconductor chips, said multi-layer substrate containing electrical connections for connection to said plurality of semiconductor chips and for connection to an external printed wiring board, the improvement wherein the upper surface of the lower most one of said multiple layers of said multi-layer substrate includes a plurality of resistive Tungsten metal traces defining a plurality of electrical heaters, said electrical heaters being positioned side by side.
In a electronic semiconductor component, said semiconductor component including a semiconductor chip, said semiconductor chip including a plurality of electrical interface leads, and a multi-layer substrate having a predetermined area for supporting said semiconductor chip on a printed circuit board, said multi-layer substrate having dimensions defining said predetermined area, said multi-layer substrate comprising layers of a predetermined material laminated together, said multi-layer substrate containing first electrical connections for connection to said electrical interface leads of said semiconductor chip and second electrical connections for electrical connection to pre-defined locations upon a printed circuit board, the improvement wherein the lower most layer of said multi-layer substrate comprises electrical heater means, said electrical heater means for producing heat uniformly over said predetermined area, said heat being sufficient to weaken said second electrical connections and being insufficient to delaminate layers of said multi-layer substrate from one another and being insufficient to weaken said first electrical connections.
A large size multi-chip module for attachment to a printed wiring board by a first thermally sensitive adhesive, comprising:
A multi-chip module for attachment to a printed wiring board with a thermally sensitive material, comprising:
In a multi-chip module array, wherein a plurality of large size multi-chip modules are bonded by thermally sensitive adhesive to a printed wiring board, and wherein each of said multi-chip modules comprises a plurality of semiconductor chips mounted to a substrate, said substrate comprising a high temperature co-fired ceramic laminate of multiple layers of aluminum oxide material, including a bottom layer that serves as the underside surface of the multi-chip module to which said thermally sensitive adhesive attaches, and wherein at least one of said multiple layers in said laminate overlying said bottom layer includes conductive metal traces, the improvement wherein said bottom layer of each said substrate of said plurality of large size multi-chip modules further comprises a metal trace attached to a top surface of said bottom layer to define an electrical heater;
Dependencies are inferred from the claim text.