H05K 1/119
Details of rigid insulating substrates therefor
Official title: {Details of rigid insulating substrates therefor, e.g. three-dimensional details (H05K1/117 takes precedence)}
H05K1/119 (Details of rigid insulating substrates therefor) appears on 278 US grants and 269 published applications in this corpus.
Search patents in H05K- Granted patents
- 278
- Published applications
- 269
- Assignees
- 208
- Inventors
- 720
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 7 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 6 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 6 | 0 |
| 2002 | 4 | 3 |
| 2003 | 9 | 7 |
| 2004 | 5 | 5 |
| 2005 | 1 | 3 |
| 2006 | 3 | 6 |
| 2007 | 4 | 7 |
| 2008 | 2 | 2 |
| 2009 | 0 | 10 |
| 2010 | 3 | 5 |
| 2011 | 3 | 5 |
| 2012 | 3 | 2 |
| 2013 | 1 | 7 |
| 2014 | 5 | 16 |
| 2015 | 9 | 6 |
| 2016 | 10 | 13 |
| 2017 | 8 | 9 |
| 2018 | 13 | 12 |
| 2019 | 18 | 33 |
| 2020 | 20 | 25 |
| 2021 | 21 | 23 |
| 2022 | 25 | 21 |
| 2023 | 16 | 20 |
| 2024 | 14 | 13 |
| 2025 | 12 | 6 |
| 2026 | 6 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Three-dimensional microwave circuit carrier and integral waveguide coupler226US 5,045,820 AMotorola, Inc. · 1991
- Miniature multiple conductor electrical connector126US 5,071,363 AMinnesota Mining and Manufacturing Company · 1991
- Sockets for "springed" semiconductor devices115US 6,033,935 AFormFactor, Inc. · 2000
- Integrated circuit package including pin and barrel interconnects111US 6,476,476 B1Amkor Technology, Inc. · 2002
- Electric junction box for an automotive vehicle99US 5,995,380 ALear Automotive Dearborn, Inc. · 1999