Printed circuit board (PCB) including a vertical launcher having a signal via for radiating signal energy through a PCB channel region

A method comprising:

• forming a signal via and a solder pad, wherein the signal via extends from a first metal layer at or proximate to a first surface of a printed circuit board (PCB) to a via pad of a second metal layer within the PCB between the first surface and a second surface of the PCB that is opposite to the first surface, wherein the second metal layer is patterned to form a waveguide opening including the via pad, and wherein the solder pad is positioned on the first surface of the PCB and coupled to the signal via;
• forming a channel region extending from the second metal layer of a printed circuit board (PCB) to the second surface of the PCB, wherein a portion of the signal via in the second metal layer is included in the channel region and configured to radiate signal energy toward the second surface;
• and
• forming a plurality of grounded vias from the first metal layer to the second surface of the PCB, such that the plurality of grounded vias border the channel region;
• and
• wherein forming the signal via comprises laser drilling the signal via.

An apparatus comprising:

• a printed circuit board (PCB) having a first surface and a second surface opposite the first surface, the PCB comprising:
• a first metal layer on or proximate to the first surface and patterned to form a first solder pad and a plurality of second solder pads,
• a second metal layer within the PCB between the first surface and the second surface, the second metal layer patterned to form a waveguide opening including a via pad, and
• a PCB channel region from the waveguide opening in the second metal layer to the second surface of the PCB;
• a signal via coupled to the first solder pad and to the via pad in the second metal layer;
• a plurality of metalized vias from the plurality of second solder pads at the first surface to the second surface of the PCB and forming a boundary around the PCB channel region;
• and
• a waveguide affixed to the waveguide opening in the second metal layer;
• and
• wherein the via pad is configured to radiate signal energy toward the second surface of the PCB through the PCB channel region;
• wherein the signal via inductively couples a signal solder ball to the waveguide.