H05K 1/111
Pads for surface mounting
Official title: {Pads for surface mounting, e.g. lay-out}
H05K1/111 (Pads for surface mounting) appears on 5,611 US grants and 6,190 published applications in this corpus.
Search patents in H05K- Granted patents
- 5,611
- Published applications
- 6,190
- Assignees
- 1,392
- Inventors
- 10,940
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 6 | 0 |
| 1986 | 7 | 0 |
| 1987 | 3 | 0 |
| 1988 | 10 | 0 |
| 1989 | 13 | 0 |
| 1990 | 16 | 0 |
| 1991 | 20 | 0 |
| 1992 | 9 | 0 |
| 1993 | 17 | 0 |
| 1994 | 32 | 0 |
| 1995 | 40 | 0 |
| 1996 | 32 | 0 |
| 1997 | 31 | 0 |
| 1998 | 59 | 0 |
| 1999 | 62 | 0 |
| 2000 | 71 | 0 |
| 2001 | 120 | 64 |
| 2002 | 129 | 123 |
| 2003 | 132 | 133 |
| 2004 | 123 | 164 |
| 2005 | 88 | 176 |
| 2006 | 126 | 184 |
| 2007 | 122 | 195 |
| 2008 | 136 | 214 |
| 2009 | 97 | 215 |
| 2010 | 140 | 163 |
| 2011 | 163 | 144 |
| 2012 | 167 | 153 |
| 2013 | 136 | 191 |
| 2014 | 149 | 245 |
| 2015 | 195 | 356 |
| 2016 | 275 | 331 |
| 2017 | 325 | 345 |
| 2018 | 344 | 355 |
| 2019 | 400 | 348 |
| 2020 | 342 | 336 |
| 2021 | 281 | 309 |
| 2022 | 271 | 330 |
| 2023 | 256 | 320 |
| 2024 | 228 | 328 |
| 2025 | 246 | 261 |
| 2026 | 176 | 207 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board and electronic device6 Oct 2026US 12,757,322 B2Shenzhen Jufei Optoelectronics Co., Ltd.
- Flexible printed circuit to suspension soldering improvement6 Oct 2026US 12,757,332 B2Western Digital Technologies, Inc.
- Circuit board structure and manufacturing method thereof6 Oct 2026US 12,757,334 B2Unimicron Technology Corp.
- Brushless DC motor power tool with combined PCB design29 Sep 2026US 12,749,945 B2Milwaukee Electric Tool Corporation
- Interconnexion film and electronic structure comprising such a film29 Sep 2026US 12,750,952 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Electronic device8 Oct 2026US 2026/0311925 A1Denso Corporation
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Chip connection structure having diret through-hole connections through adhesive film and wiring substrate332US 5,870,289 AHitachi, Ltd. · 1999
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- Tamper-resistant wireless article including an antenna310US 6,421,013 B1Amerasia International Technology, Inc. · 2002
- LED illumination apparatus and card-type LED illumination source287US 6,949,772 B2Matsushita Electric Industrial Co., Ltd. · 2005