H05K 1/112
Directly combined with via connections
Official title: {directly combined with via connections}
H05K1/112 (Directly combined with via connections) appears on 2,824 US grants and 2,972 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,824
- Published applications
- 2,972
- Assignees
- 762
- Inventors
- 5,561
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 5 | 0 |
| 1986 | 5 | 0 |
| 1987 | 2 | 0 |
| 1988 | 6 | 0 |
| 1989 | 8 | 0 |
| 1990 | 11 | 0 |
| 1991 | 10 | 0 |
| 1992 | 3 | 0 |
| 1993 | 6 | 0 |
| 1994 | 16 | 0 |
| 1995 | 22 | 0 |
| 1996 | 18 | 0 |
| 1997 | 21 | 0 |
| 1998 | 43 | 0 |
| 1999 | 42 | 0 |
| 2000 | 52 | 0 |
| 2001 | 81 | 46 |
| 2002 | 92 | 85 |
| 2003 | 100 | 102 |
| 2004 | 92 | 119 |
| 2005 | 65 | 119 |
| 2006 | 94 | 125 |
| 2007 | 79 | 113 |
| 2008 | 95 | 126 |
| 2009 | 66 | 122 |
| 2010 | 86 | 96 |
| 2011 | 100 | 86 |
| 2012 | 92 | 82 |
| 2013 | 86 | 103 |
| 2014 | 80 | 108 |
| 2015 | 93 | 131 |
| 2016 | 121 | 123 |
| 2017 | 123 | 115 |
| 2018 | 118 | 123 |
| 2019 | 140 | 121 |
| 2020 | 124 | 157 |
| 2021 | 126 | 131 |
| 2022 | 114 | 139 |
| 2023 | 113 | 140 |
| 2024 | 98 | 135 |
| 2025 | 105 | 125 |
| 2026 | 62 | 100 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board and electronic device6 Oct 2026US 12,757,322 B2Shenzhen Jufei Optoelectronics Co., Ltd.
- Brushless DC motor power tool with combined PCB design29 Sep 2026US 12,749,945 B2Milwaukee Electric Tool Corporation
- Thermoplastic interposer15 Sep 2026US 12,739,965 B2Meta Platforms Technologies, LLC
- Method and apparatus for surface mount connections8 Sep 2026US 12,731,922 B2Ciena Corporation
- Printed circuit board8 Sep 2026US 12,733,094 B2Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
- Component Carrier With Embedded Vertical Connection, And Manufacture Method1 Oct 2026US 2026/0304619 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Component Carrier With Electronic Component and Thick Thermally Conductive Layers on Both Sides1 Oct 2026US 2026/0304632 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Chip connection structure having diret through-hole connections through adhesive film and wiring substrate332US 5,870,289 AHitachi, Ltd. · 1999
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- Tamper-resistant wireless article including an antenna310US 6,421,013 B1Amerasia International Technology, Inc. · 2002
- LED illumination apparatus and card-type LED illumination source287US 6,949,772 B2Matsushita Electric Industrial Co., Ltd. · 2005