H05K 1/114
Pad being close to via, but not surrounding the via
Official title: {Pad being close to via, but not surrounding the via}
H05K1/114 (Pad being close to via, but not surrounding the via) appears on 432 US grants and 424 published applications in this corpus.
Search patents in H05K- Granted patents
- 432
- Published applications
- 424
- Assignees
- 213
- Inventors
- 959
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 7 | 0 |
| 1996 | 7 | 0 |
| 1997 | 5 | 0 |
| 1998 | 12 | 0 |
| 1999 | 5 | 0 |
| 2000 | 12 | 0 |
| 2001 | 11 | 14 |
| 2002 | 23 | 18 |
| 2003 | 23 | 22 |
| 2004 | 23 | 23 |
| 2005 | 10 | 13 |
| 2006 | 16 | 34 |
| 2007 | 15 | 20 |
| 2008 | 18 | 22 |
| 2009 | 10 | 23 |
| 2010 | 18 | 19 |
| 2011 | 21 | 9 |
| 2012 | 13 | 9 |
| 2013 | 15 | 17 |
| 2014 | 10 | 9 |
| 2015 | 11 | 19 |
| 2016 | 11 | 15 |
| 2017 | 20 | 9 |
| 2018 | 16 | 26 |
| 2019 | 19 | 18 |
| 2020 | 22 | 19 |
| 2021 | 14 | 10 |
| 2022 | 10 | 10 |
| 2023 | 11 | 13 |
| 2024 | 5 | 12 |
| 2025 | 8 | 9 |
| 2026 | 4 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and electronic device6 Oct 2026US 12,757,322 B2Shenzhen Jufei Optoelectronics Co., Ltd.
- Compact ball grid array package for use in touch panel controller and touch panel device utilizing the same19 May 2026US 12,635,543 B2Novatek Microelectronics Corp.
- Vertical power supply system and manufacturing method of connection board21 Apr 2026US 12,610,453 B2Delta Electronics (Shanghai) Co., Ltd.
- Wiring board21 Apr 2026US 12,610,465 B2Shinko Electric Industries Co., Ltd.
- Technique of wiring provided on a wiring circuit board that is mounted in an electronic apparatus30 Sep 2025US 12,432,846 B2Canon Kabushiki Kaisha
- Device including board member and manufacturing methods27 Aug 2026US 2026/0255481 A1
- Printed circuit board hardware interface with reduced crosstalk20 Aug 2026US 2026/0247522 A1Microsoft Technology Licensing, LLC
- Electronic device20 Aug 2026US 2026/0247531 A1InnoCare Optoelectronics Corporation
- Circuit board and circuit board assembly2 Jul 2026US 2026/0190226 A1Zte Corporation
- Circuit board for connectors18 Jun 2026US 2026/0173254 A1Min Di Consultants Ltd.
Most cited
By later US patents
- Optimized routing scheme for an integrated circuit/printed circuit board167US 5,847,936 ASun Microsystems, Inc. · 1998
- Process for mounting electronic device and semiconductor device167US 6,208,525 B1Hitachi Hokkai Semiconductor, Ltd. · 2001
- Method of controlling solder ball size of BGA IC components152US 5,519,580 AIntel Corporation · 1996
- Substrate for mounting semiconductor chips144US 6,281,450 B1Hitachi Chemical Company, Ltd. · 2001
- Solder ball interconnected assembly129US 5,591,941 AInternational Business Machines Corporation · 1997