Substrate for mounting semiconductor chips
AssigneeHitachi Chemical Company, Ltd.
InventorsNaoyuki Urasaki, Yasusi Simada, Yoshiyuki Tsuru, Akishi Nakaso, Itsuo Watanabe
Life of this patent
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Abstract
A substrate for mounting a semiconductor chip having bumps using an adhesive thereon, said substrate being, for instance, provided with an insulating coating having an opening in the semiconductor chip mounting area so that the wiring conductors will not be exposed to the substrate surface near the boundary of the semiconductor chip mounting area, is improved in connection reliability and has high mass productivity.
Claims9
A substrate for mounting a semiconductor chip having bumps with an adhesive, characterized in that at least connecting terminals for making connection to the bumps of the semiconductor chip are provided in the area of the substrate surface where the semiconductor chip is to be mounted, and wiring conductors are provided outside the area where the semiconductor chip is to be mounted, said wiring conductors being so disposed that they will not be exposed to the substrate surface near the boundary of the area where the semiconductor chip is to be mounted, wherein the wiring conductors are led out from the respective connecting terminals and laid beyond the boundary of the semiconductor chip mounting area, with an insulating coating of said wiring conductors being formed outside of the semiconductor chin mounting area and not formed in the semiconductor chip mounting area, and in order that the wiring conductors may not be exposed to the surface near the boundary of the semiconductor chip mounting area, the surface of the semiconductor chip mounting area near the boundary of the semiconductor chip mounting area is coated with an adhesive for fixing the semiconductor chip.
A substrate for mounting a semiconductor chip having bumps with an adhesive, characterized in that at least connecting terminals for making connection to the bumps of the semiconductor chip are provided in the area of the substrate surface where the semiconductor chip is to be mounted, and wiring conductors are provided outside the area where the semiconductor chip is to be mounted, said wiring conductors being so disposed that they will not be exposed to the substrate surface near the boundary of the area where the semiconductor chip is to be mounted, wherein the wiring conductors are led out from respective connecting terminals and laid beyond the area of the semiconductor chip mounting area, and in order that the wiring conductors may not be exposed near the boundary of the semiconductor chip mounting area, an insulating coating of the wiring conductors is provided to coat not only the wiring conductors at the boundary of the semiconductor chip mounting area but also the outside of said area, the insulating coating being formed to the point of 20 to 300 μm inwards from the boundary of the semiconductor chip mounting area.
Dependencies are inferred from the claim text.