Technique of wiring provided on a wiring circuit board that is mounted in an electronic apparatus

A circuit board comprising:

• a semiconductor chip provided with a plurality of circuit blocks and a plurality of first electrode pads connected to any of the plurality of circuit blocks;
• a first surface on which the semiconductor chip is mounted;
• and
• a second surface facing a mounting substrate on which a wiring circuit board is mounted,
• wherein the first surface includes:
• a plurality of second electrode pads connected to the plurality of first electrode pads provided on the semiconductor chip, through a wire, and
• a plurality of wirings connected to the plurality of second electrode pads,
• the second surface includes a plurality of ball electrodes connected to any of the plurality of wirings and disposed to come into contact with any of a plurality of opposing pads provided on the mounting substrate,
• a first wiring among the plurality of wirings is a ground wiring for supplying a ground potential to a first circuit block among the plurality of circuit blocks,
• a second wiring among the plurality of wirings is a ground wiring for supplying a ground potential to a second circuit block among the plurality of circuit blocks,
• the second surface further includes a first extension pad connected to a first ball electrode connected to the first wiring and a second extension pad connected to a second ball electrode connected to the second wiring, and
• the first extension pad and the second extension pad are disposed at positions at which the first extension pad and the second extension pad are connected to each other on the second surface side through a single ball electrode.

A semiconductor device comprising:

• a semiconductor chip provided with a plurality of circuit blocks and a plurality of first electrode pads connected to any of the plurality of circuit blocks;
• a wiring circuit board on which the semiconductor chip is mounted;
• and
• a sealer that seals the semiconductor chip on the wiring circuit board,
• wherein the wiring circuit board includes:
• a first surface on which the semiconductor chip is mounted, and
• a second surface that faces a mounting substrate on which the semiconductor device is mounted,
• the first surface includes:
• a plurality of second electrode pads connected to the plurality of first electrode pads provided on the semiconductor chip, using a wire, and
• a plurality of wirings connected to any of the plurality of second electrode pads,
• the second surface includes a plurality of ball electrodes connected to any of the plurality of wirings and disposed to come into contact with any of a plurality of opposing pads provided on the mounting substrate,
• a first wiring among the plurality of wirings is a ground wiring for supplying a ground potential to a first circuit block among the plurality of circuit blocks,
• a second wiring among the plurality of wirings is a ground wiring for supplying a ground potential to a second circuit block among the plurality of circuit blocks,
• the second surface further includes a first extension pad connected to a first ball electrode connected to the first wiring and a second extension pad connected to a second ball electrode connected to the second wiring, and
• the first extension pad and the second extension pad are disposed at positions at which the first extension pad and the second extension pad are connected to each other on the second surface side through a single ball electrode.