H01J 37/32798
Further details of plasma apparatus not provided for in groups h01j37/3244 -
Official title: {Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus}
H01J37/32798 (Further details of plasma apparatus not provided for in groups h01j37/3244 -) appears on 2,779 US grants and 4,027 published applications in this corpus.
Search patents in H01J- Granted patents
- 2,779
- Published applications
- 4,027
- Assignees
- 752
- Inventors
- 7,643
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 5 | 0 |
| 1993 | 13 | 0 |
| 1994 | 17 | 0 |
| 1995 | 25 | 0 |
| 1996 | 16 | 0 |
| 1997 | 20 | 0 |
| 1998 | 32 | 0 |
| 1999 | 37 | 0 |
| 2000 | 59 | 0 |
| 2001 | 54 | 27 |
| 2002 | 51 | 53 |
| 2003 | 47 | 52 |
| 2004 | 44 | 62 |
| 2005 | 35 | 72 |
| 2006 | 21 | 53 |
| 2007 | 22 | 61 |
| 2008 | 23 | 63 |
| 2009 | 30 | 73 |
| 2010 | 27 | 70 |
| 2011 | 39 | 78 |
| 2012 | 41 | 77 |
| 2013 | 53 | 101 |
| 2014 | 65 | 139 |
| 2015 | 81 | 219 |
| 2016 | 114 | 230 |
| 2017 | 151 | 235 |
| 2018 | 154 | 232 |
| 2019 | 174 | 222 |
| 2020 | 197 | 233 |
| 2021 | 155 | 261 |
| 2022 | 173 | 297 |
| 2023 | 167 | 341 |
| 2024 | 210 | 293 |
| 2025 | 239 | 268 |
| 2026 | 175 | 215 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Shutter disc for a semiconductor processing tool6 Oct 2026US 12,753,488 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Flow control arrangements, semiconductor processing systems having flow control arrangements, and flow control methods6 Oct 2026US 12,753,499 B2ASM IP Holding B. V.
- Plasma processing apparatus and gas exhaust method6 Oct 2026US 12,755,945 B2Hitachi High-Tech Corporation
- Semiconductor manufacturing apparatus and semiconductor device manufacturing method6 Oct 2026US 12,755,946 B2Kioxia Corporation
- Methods and apparatus for generating atmospheric pressure, low temperature plasma6 Oct 2026US 12,757,313 B2TellaPure, LLC
- Semiconductor cleaning apparatus and method8 Oct 2026US 2026/0307113 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Device for reducing a parasitic plasma and a substrate processing apparatus having the same8 Oct 2026US 2026/0311971 A1ASM IP Holding B. V.
- Integration of vapor deposition process into plasma etch reactor8 Oct 2026US 2026/0311972 A1Lam Research Corporation
- Gas supply line arrangements1 Oct 2026US 2026/0297736 A1Lam Research Corporation
- Multiple-chamber reactor for selective deposition of silicon nitride and method of using same1 Oct 2026US 2026/0297752 A1ASM IP Holding B. V.
Most cited
By later US patents
- CVD Processing chamber1,003US 5,558,717 AAPPLIED Materials.Inc. · 1996
- Plasma cleaning method for removing residues in a plasma treatment chamber842US 5,356,478 ALam Research Corporation · 1994
- Thermally floating pedestal collar in a chemical vapor deposition chamber805US 5,846,332 AAPPLIED Materials.Inc. · 1998
- Remote plasma source seasoning624US 7,989,365 B2APPLIED Materials.Inc. · 2011
- Method for improved remote microwave plasma source for use with substrate processing system621US 6,271,148 B1APPLIED Materials.Inc. · 2001