H01J 37/32908
Utilities
Official title: {Utilities}
H01J37/32908 (Utilities) appears on 57 US grants and 81 published applications in this corpus.
Search patents in H01J- Granted patents
- 57
- Published applications
- 81
- Assignees
- 29
- Inventors
- 196
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 1 |
| 2011 | 0 | 2 |
| 2012 | 0 | 5 |
| 2013 | 2 | 1 |
| 2014 | 3 | 2 |
| 2015 | 2 | 7 |
| 2016 | 2 | 4 |
| 2017 | 8 | 14 |
| 2018 | 2 | 8 |
| 2019 | 7 | 3 |
| 2020 | 4 | 9 |
| 2021 | 8 | 5 |
| 2022 | 6 | 3 |
| 2023 | 5 | 6 |
| 2024 | 3 | 2 |
| 2025 | 2 | 2 |
| 2026 | 2 | 6 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Apparatuses for cleaning a multi-station semiconductor processing chamber31 Mar 2026US 12,593,641 B2Lam Research Corporation
- Linear arrangement for substrate processing tools24 Feb 2026US 12,562,356 B2Lam Research Corporation
- Encapsulated RFID in consumable chamber parts8 Jul 2025US 12,354,895 B2Lam Research Corporation
- Plasma source Ion implanter with preparation chamber for linear or cross transferring workpiece25 Feb 2025US 12,234,545 B2
- Calibration jig and calibration method19 Nov 2024US 12,148,645 B2APPLIED Materials.Inc.
- Apparatuses for cleaning a multi-station semiconductor processing chamber9 Jul 2026US 2026/0198246 A1Lam Research Corporation
- Process chamber and substrate processing apparatus2 Jul 2026US 2026/0188624 A1Semes Co., Ltd.
- Semiconductor manufacturing equipment and semiconductor manufacturing method2 Jul 2026US 2026/0190907 A1Semes Co., Ltd.
- Linear arrangement for substrate processing tools18 Jun 2026US 2026/0171376 A1Lam Research Corporation
- Throttle valve position endpoint control within a deposition process15 Jan 2026US 2026/0015727 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Plasma and induction heating power supply systems and related methods44US 9,503,006 B2TRUMPF Huettinger GmbH + Co. KG · 2016
- Mask shrink layer for high aspect ratio dielectric etch44US 9,543,148 B1Lam Research Corporation · 2017
- Controlling multiple plasma processes42US 10,971,342 B2Trumpf Huettinger Sp. Z O. O. · 2021
- Wear detection of consumable part in semiconductor manufacturing equipment27US 10,014,198 B2Lam Research Corporation · 2018
- Technique to deposit sidewall passivation for high aspect ratio cylinder etch25US 9,543,158 B2Lam Research Corporation · 2017