Wear detection of consumable part in semiconductor manufacturing equipment

A method for determining wear of a consumable part, the method comprising:

• loading a substrate on a transfer arm in a semiconductor manufacturing chamber, the transfer arm including a sensor;
• measuring, with the sensor, a first distance from the sensor to a surface of a consumable part as the transfer arm travels over the consumable part along a linear travel position into the semiconductor manufacturing chamber, the consumable part being subject to wear during operation of the chamber;
• measuring, with the sensor, a second distance from the sensor to a surface of a reference part as the transfer arm travels over the reference part along the linear travel position, the reference part not being subject to wear during operation of the chamber;
• and
• determining a wear amount of the consumable part based on the first distance and the second distance.

A chamber for processing a substrate, the chamber comprising:

• a reference part in the chamber;
• a consumable part within the chamber, the consumable part accumulating deposition during operation of the chamber;
• a transfer arm for transferring the substrate into the chamber;
• a sensor on the transfer arm, wherein the sensor is configured to measure a first distance from the sensor to a surface of the consumable part as the transfer arm travels over the consumable part along a linear travel position into the chamber, wherein the sensor is configured to measure a second distance from the sensor to a surface of the reference part as the transfer arm travels over the reference part along the linear travel position;
• and
• a controller configured to determine an amount of deposition on the consumable part based on the first distance and the second distance.