H01J 37/32889
Connection or combination with other apparatus
Official title: {Connection or combination with other apparatus}
H01J37/32889 (Connection or combination with other apparatus) appears on 115 US grants and 165 published applications in this corpus.
Search patents in H01J- Granted patents
- 115
- Published applications
- 165
- Assignees
- 70
- Inventors
- 446
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 7 |
| 2012 | 0 | 3 |
| 2013 | 2 | 8 |
| 2014 | 4 | 6 |
| 2015 | 11 | 15 |
| 2016 | 12 | 17 |
| 2017 | 12 | 12 |
| 2018 | 13 | 13 |
| 2019 | 5 | 9 |
| 2020 | 11 | 14 |
| 2021 | 11 | 12 |
| 2022 | 8 | 9 |
| 2023 | 6 | 8 |
| 2024 | 7 | 8 |
| 2025 | 10 | 14 |
| 2026 | 3 | 6 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Scrubber, substrate processing system including the same, and substrate processing method using the same8 Sep 2026US 12,731,770 B2Korea Institute of Machinery & Materials
- Substrate processing apparatus using plasma phase shift14 Jul 2026US 12,683,124 B2ASM IP Holding B. V.
- Aligner station with lifting mechanism14 Apr 2026US 12,603,261 B2APPLIED Materials.Inc.
- High pressure spatial chemical vapor deposition system and related process18 Nov 2025US 12,473,642 B2Lehigh University
- Plasma process system for multi-station11 Nov 2025US 12,469,678 B2En2Core Technology, Inc.
- Substrate processing apparatus including shared rf generator6 Aug 2026US 2026/0229461 A1ASM IP Holding B. V.
- Aligner station with lifting mechanism30 Jul 2026US 2026/0221400 A1APPLIED Materials.Inc.
- Reaction chamber and wafer etching device16 Jul 2026US 2026/0206534 A1Beijing E-Town Semiconductor Technology Co., Ltd.
- Substrate processing apparatus and method of processing substrate18 Jun 2026US 2026/0171375 A1SCREEN Holdings Co., Ltd.
- Ru etching induced by electron beam irradiation and remote plasma28 May 2026US 2026/0148934 A1University of Maryland, College Park
Most cited
By later US patents
- Controlling multiple plasma processes42US 10,971,342 B2Trumpf Huettinger Sp. Z O. O. · 2021
- Multi-zone temperature control for semiconductor wafer37US 8,404,572 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Atomic layer etching for enhanced bottom-up feature fill35US 9,837,312 B1Lam Research Corporation · 2017
- Damage isolation by shaped beam delivery in laser scribing process23US 9,029,242 B2APPLIED Materials.Inc. · 2015
- Wafer dicing using femtosecond-based laser and plasma etch18US 8,642,448 B2APPLIED Materials.Inc. · 2014