H01J 37/32807
Construction
Official title: {Construction (includes replacing parts of the apparatus)}
H01J37/32807 (Construction) appears on 158 US grants and 281 published applications in this corpus.
Search patents in H01J- Granted patents
- 158
- Published applications
- 281
- Assignees
- 78
- Inventors
- 664
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 2 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 3 |
| 2012 | 0 | 4 |
| 2013 | 2 | 7 |
| 2014 | 2 | 5 |
| 2015 | 1 | 14 |
| 2016 | 9 | 21 |
| 2017 | 10 | 15 |
| 2018 | 10 | 15 |
| 2019 | 9 | 13 |
| 2020 | 14 | 21 |
| 2021 | 11 | 20 |
| 2022 | 16 | 26 |
| 2023 | 11 | 38 |
| 2024 | 24 | 27 |
| 2025 | 21 | 33 |
| 2026 | 17 | 17 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Ceramic sintered body for semiconductor production equipment and manufacturing method thereof1 Sep 2026US 12,725,763 B2CoorsTek, Inc.
- Detection device, processing system, and transfer method11 Aug 2026US 12,706,280 B2Tokyo Electron Limited
- Substrate processing apparatus11 Aug 2026US 12,706,283 B2Semes Co., Ltd.
- Focus ring and substrate processing apparatus including the same28 Jul 2026US 12,695,068 B2Samsung Electronics Co., Ltd.
- Wafer placement table23 Jun 2026US 12,665,174 B2NGK Insulators, Ltd.
- Conditioning method and plasma processing system20 Aug 2026US 2026/0245841 A1Tokyo Electron Limited
- Aligner station with lifting mechanism30 Jul 2026US 2026/0221400 A1APPLIED Materials.Inc.
- Wide-coverage edge ring for enhanced shielding in substrate processing systems9 Jul 2026US 2026/0196447 A1Lam Research Corporation
- Y2o3 thin film having plasma etching resistance and its manufacturing method2 Jul 2026US 2026/0185217 A1EG Chem Co., Ltd.
- Controlling gas flows in processing tool2 Jul 2026US 2026/0188622 A1Lam Research Corporation
Most cited
By later US patents
- Semiconductor system assemblies and methods of operation152US 9,287,095 B2APPLIED Materials.Inc. · 2016
- Radio frequency (RF) ground return arrangements15US 9,779,916 B2Lam Research Corporation · 2017
- Apparatus for treating a gas in a conduit13US 9,378,928 B2APPLIED Materials.Inc. · 2016
- Focus ring replacement method and plasma processing system9US 10,490,392 B2Tokyo Electron Limited · 2019
- Apparatus for treating a gas in a conduit8US 9,767,990 B2APPLIED Materials.Inc. · 2017