Focus ring replacement method and plasma processing system

A method performed by a processor of a plasma processing system including a transfer device and a plasma processing apparatus that includes a process chamber, the method comprising:

• controlling the transfer device to transfer a first focus ring out of the process chamber without opening the process chamber to atmosphere, the process chamber including a mount table on a surface of which the first focus ring is placed;
• detecting a position of a second focus ring held on the transfer device;
• and
• controlling the transfer device to transfer the second focus ring into the process chamber and place the second focus ring on the surface of the mount table based on the detected position without opening the process chamber to the atmosphere, wherein
• each of the first focus ring and the second focus ring includes an inner edge defining a circumference of an opening formed in each of the first focus ring and the second focus ring;
• and
• the position of the second focus ring is detected based on a detection of the inner edge of the second focus ring by at least one sensor.

A method of replacing a first focus ring configured to surround a substrate in a process chamber with a second focus ring, the method comprising:

• determining whether the first focus ring needs to be replaced;
• determining whether the plasma processing apparatus is in a replaceable state where the first focus ring is replaceable;
• transferring the first focus ring out of the process chamber when it is determined that the first focus ring needs to be replaced and the plasma processing apparatus is in the replaceable state;
• transferring the second focus ring into the process chamber;
• and
• cleaning the process chamber before or after transferring the first focus ring out of the process chamber, wherein
• the transferring of the first focus ring and the transferring of the second focus ring are performed without opening the process chamber to atmosphere;
• the plasma processing apparatus is determined to be in the replaceable state when no substrate is being processed in the process chamber;
• and
• when a substrate is being processed in the process chamber, the plasma processing apparatus is determined to be in the replaceable state when processing of all substrates in a same lot as the substrate is completed.