H01J 37/32816
Pressure
Official title: {Pressure}
H01J37/32816 (Pressure) appears on 1,159 US grants and 1,784 published applications in this corpus.
Search patents in H01J- Granted patents
- 1,159
- Published applications
- 1,784
- Assignees
- 426
- Inventors
- 3,766
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 9 | 0 |
| 1999 | 10 | 0 |
| 2000 | 20 | 0 |
| 2001 | 16 | 11 |
| 2002 | 17 | 16 |
| 2003 | 12 | 22 |
| 2004 | 15 | 18 |
| 2005 | 13 | 23 |
| 2006 | 7 | 23 |
| 2007 | 7 | 23 |
| 2008 | 12 | 32 |
| 2009 | 12 | 37 |
| 2010 | 11 | 33 |
| 2011 | 15 | 29 |
| 2012 | 15 | 34 |
| 2013 | 30 | 49 |
| 2014 | 29 | 36 |
| 2015 | 32 | 79 |
| 2016 | 38 | 97 |
| 2017 | 63 | 106 |
| 2018 | 65 | 91 |
| 2019 | 77 | 109 |
| 2020 | 88 | 94 |
| 2021 | 66 | 135 |
| 2022 | 83 | 131 |
| 2023 | 69 | 172 |
| 2024 | 91 | 149 |
| 2025 | 130 | 131 |
| 2026 | 86 | 104 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Plasma processing apparatus and gas exhaust method6 Oct 2026US 12,755,945 B2Hitachi High-Tech Corporation
- Methods and apparatus for generating atmospheric pressure, low temperature plasma6 Oct 2026US 12,757,313 B2TellaPure, LLC
- Method for etching an etch layer6 Oct 2026US 12,757,660 B2Lam Research Corporation
- Remote plasma deposition with electrostatic clamping6 Oct 2026US 12,757,682 B2Lam Research Corporation
- Gas supply system, gas control system, plasma processing apparatus, and gas control method29 Sep 2026US 12,749,657 B2Tokyo Electron Limited
- Device for reducing a parasitic plasma and a substrate processing apparatus having the same8 Oct 2026US 2026/0311971 A1ASM IP Holding B. V.
- Integration of vapor deposition process into plasma etch reactor8 Oct 2026US 2026/0311972 A1Lam Research Corporation
- Substrate processing apparatus and gas supply method1 Oct 2026US 2026/0302139 A1Tokyo Electron Limited
- Higher pressure purge for impurity reduction in radical treatment chamber1 Oct 2026US 2026/0302143 A1APPLIED Materials.Inc.
- High-performance adaptable sampling system1 Oct 2026US 2026/0302145 A1Tokyo Electron Limited
Most cited
By later US patents
- CVD Processing chamber1,003US 5,558,717 AAPPLIED Materials.Inc. · 1996
- Thermally floating pedestal collar in a chemical vapor deposition chamber805US 5,846,332 AAPPLIED Materials.Inc. · 1998
- Plasma treatment method and apparatus581US 5,242,539 AHitachi, Ltd. · 1993
- Semiconductor device fabrication chamber cleaning method and apparatus with recirculation of cleaning gas571US 6,863,019 B2APPLIED Materials.Inc. · 2005
- Apparatus for substrate processing with improved throughput and yield568US 6,129,044 AAPPLIED Materials.Inc. · 2000