H01J 37/32834
Exhausting
Official title: {Exhausting}
H01J37/32834 (Exhausting) appears on 748 US grants and 1,093 published applications in this corpus.
Search patents in H01J- Granted patents
- 748
- Published applications
- 1,093
- Assignees
- 229
- Inventors
- 2,464
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 9 | 0 |
| 1999 | 8 | 0 |
| 2000 | 19 | 0 |
| 2001 | 16 | 11 |
| 2002 | 16 | 14 |
| 2003 | 12 | 19 |
| 2004 | 13 | 15 |
| 2005 | 12 | 18 |
| 2006 | 4 | 15 |
| 2007 | 4 | 16 |
| 2008 | 9 | 18 |
| 2009 | 9 | 23 |
| 2010 | 6 | 17 |
| 2011 | 12 | 21 |
| 2012 | 9 | 17 |
| 2013 | 16 | 28 |
| 2014 | 20 | 17 |
| 2015 | 19 | 54 |
| 2016 | 19 | 56 |
| 2017 | 42 | 66 |
| 2018 | 39 | 55 |
| 2019 | 44 | 72 |
| 2020 | 63 | 63 |
| 2021 | 40 | 82 |
| 2022 | 52 | 89 |
| 2023 | 41 | 85 |
| 2024 | 62 | 74 |
| 2025 | 77 | 82 |
| 2026 | 38 | 66 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Plasma processing apparatus and gas exhaust method6 Oct 2026US 12,755,945 B2Hitachi High-Tech Corporation
- Method for etching an etch layer6 Oct 2026US 12,757,660 B2Lam Research Corporation
- Gas supply system, gas control system, plasma processing apparatus, and gas control method29 Sep 2026US 12,749,657 B2Tokyo Electron Limited
- Advanced OES characterization29 Sep 2026US 12,749,664 B2Tokyo Electron Limited
- Higher pressure purge for impurity reduction in radical treatment chamber8 Sep 2026US 12,731,769 B2APPLIED Materials.Inc.
- Device for reducing a parasitic plasma and a substrate processing apparatus having the same8 Oct 2026US 2026/0311971 A1ASM IP Holding B. V.
- Substrate processing apparatus and gas supply method1 Oct 2026US 2026/0302139 A1Tokyo Electron Limited
- Higher pressure purge for impurity reduction in radical treatment chamber1 Oct 2026US 2026/0302143 A1APPLIED Materials.Inc.
- Plasma processing method and apparatus24 Sep 2026US 2026/0290755 A1Tokyo Electron Limited
- Method for removing by-product in plasma etching apparatus24 Sep 2026US 2026/0290763 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- CVD Processing chamber1,003US 5,558,717 AAPPLIED Materials.Inc. · 1996
- Thermally floating pedestal collar in a chemical vapor deposition chamber805US 5,846,332 AAPPLIED Materials.Inc. · 1998
- Plasma treatment method and apparatus581US 5,242,539 AHitachi, Ltd. · 1993
- Semiconductor device fabrication chamber cleaning method and apparatus with recirculation of cleaning gas571US 6,863,019 B2APPLIED Materials.Inc. · 2005
- Apparatus for substrate processing with improved throughput and yield568US 6,129,044 AAPPLIED Materials.Inc. · 2000