H01J 37/32844
Treating effluent gases
Official title: {Treating effluent gases}
H01J37/32844 (Treating effluent gases) appears on 134 US grants and 193 published applications in this corpus.
Search patents in H01J- Granted patents
- 134
- Published applications
- 193
- Assignees
- 67
- Inventors
- 457
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 5 | 2 |
| 2002 | 4 | 5 |
| 2003 | 1 | 4 |
| 2004 | 3 | 4 |
| 2005 | 2 | 3 |
| 2006 | 1 | 3 |
| 2007 | 1 | 2 |
| 2008 | 3 | 5 |
| 2009 | 2 | 6 |
| 2010 | 0 | 1 |
| 2011 | 1 | 5 |
| 2012 | 1 | 1 |
| 2013 | 3 | 6 |
| 2014 | 5 | 2 |
| 2015 | 2 | 13 |
| 2016 | 4 | 7 |
| 2017 | 8 | 13 |
| 2018 | 6 | 7 |
| 2019 | 8 | 7 |
| 2020 | 9 | 16 |
| 2021 | 8 | 10 |
| 2022 | 7 | 15 |
| 2023 | 9 | 19 |
| 2024 | 11 | 11 |
| 2025 | 17 | 18 |
| 2026 | 7 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Scrubber, substrate processing system including the same, and substrate processing method using the same8 Sep 2026US 12,731,770 B2Korea Institute of Machinery & Materials
- High efficiency trap for particle collection in a vacuum foreline21 Jul 2026US 12,689,010 B2APPLIED Materials.Inc.
- Apparatus with heated filter and operation method of the same21 Jul 2026US 12,689,011 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor manufacturing facility and method of operating the same14 Jul 2026US 12,683,132 B2Lot Ces Co., Ltd.
- Low temperature carbon gapfill with reduced void or seam formation26 May 2026US 12,642,025 B2APPLIED Materials.Inc.
- Backup abatement reactor for a processing tool24 Sep 2026US 2026/0290764 A1APPLIED Materials.Inc.
- Semiconductor manufacturing facility and method of operating the same17 Sep 2026US 2026/0279744 A1Lot Ces Co., Ltd.
- Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium16 Jul 2026US 2026/0204526 A1Kokusai Electric Corporation
- Downstream port gases introduced into plasma abatement system25 Jun 2026US 2026/0179884 A1APPLIED Materials.Inc.
- A plasma processing system with a gas recycling system18 Jun 2026US 2026/0166479 A1Lam Research Corporation
Most cited
By later US patents
- Semiconductor device fabrication chamber cleaning method and apparatus with recirculation of cleaning gas571US 6,863,019 B2APPLIED Materials.Inc. · 2005
- Parallel plate apparatus for in-situ vacuum line cleaning for substrate processing equipment90US 6,193,802 B1APPLIED Materials.Inc. · 2001
- Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions71US 6,187,072 B1APPLIED Materials.Inc. · 2001
- Microwave apparatus for in-situ vacuum line cleaning for substrate processing equipment70US 6,045,618 AAPPLIED Materials.Inc. · 2000
- Method and apparatus for controlling polymerized teos build-up in vacuum pump lines53US 6,197,119 B1MKS Instruments, Inc. · 2001