G01R 31/318505
Test of modular systems
Official title: {Test of Modular systems, e.g. Wafers, MCM's}
G01R31/318505 (Test of modular systems) appears on 1,125 US grants and 939 published applications in this corpus.
Search patents in G01R- Granted patents
- 1,125
- Published applications
- 939
- Assignees
- 313
- Inventors
- 1,729
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 9 | 0 |
| 1986 | 1 | 0 |
| 1987 | 9 | 0 |
| 1988 | 1 | 0 |
| 1989 | 9 | 0 |
| 1990 | 12 | 0 |
| 1991 | 6 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 13 | 0 |
| 1995 | 16 | 0 |
| 1996 | 15 | 0 |
| 1997 | 17 | 0 |
| 1998 | 17 | 0 |
| 1999 | 23 | 0 |
| 2000 | 19 | 0 |
| 2001 | 34 | 8 |
| 2002 | 24 | 32 |
| 2003 | 27 | 36 |
| 2004 | 44 | 47 |
| 2005 | 44 | 51 |
| 2006 | 33 | 35 |
| 2007 | 46 | 49 |
| 2008 | 43 | 54 |
| 2009 | 44 | 41 |
| 2010 | 51 | 36 |
| 2011 | 50 | 46 |
| 2012 | 24 | 35 |
| 2013 | 39 | 50 |
| 2014 | 41 | 41 |
| 2015 | 48 | 46 |
| 2016 | 45 | 44 |
| 2017 | 52 | 34 |
| 2018 | 28 | 30 |
| 2019 | 28 | 27 |
| 2020 | 31 | 33 |
| 2021 | 23 | 32 |
| 2022 | 32 | 35 |
| 2023 | 42 | 31 |
| 2024 | 31 | 20 |
| 2025 | 23 | 28 |
| 2026 | 12 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Integrated circuit, memory device including the integrated circuit, and method of operating the same25 Aug 2026US 12,716,943 B2Samsung Electronics Co., Ltd.
- Wrapper cell design and built-in self-test architecture for 3DIC test and diagnosis21 Jul 2026US 12,687,578 B2Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for schedule-based I/O multiplexing for integrated circuit (IC) scan test14 Jul 2026US 12,681,084 B1Marvell Asia Pte Ltd
- Test and repair of interconnects between chips9 Jun 2026US 12,650,459 B2Intel Corporation
- Testing circuitry in a stacked semiconductor device using through silicon vias12 May 2026US RE50,887 E1Longitude Licensing Limited
- Wrapper Cell Design and Built-In Self-Test Architecture for 3DIC Test and Diagnosis8 Oct 2026US 2026/0309778 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method and system for testing three-dimensional semiconductor devices27 Aug 2026US 2026/0251710 A1Marvell Asia Pte Ltd
- Semiconductor device for performing test operation of through-silicon vias13 Aug 2026US 2026/0235677 A1Samsung Electronics Co., Ltd.
- Die-to-die bypass mode for chiplet initialization, configuration, and communication6 Aug 2026US 2026/0228147 A1Microsoft Technology Licensing, LLC
- Wafer scale active thermal interposer for device testing30 Jul 2026US 2026/0219315 A1Advantest Test Solutions, Inc.
Most cited
By later US patents
- Making and testing an integrated circuit using high density probe points307US 5,103,557 A1992
- Data processing system having a memory using object-based information and a protection scheme for determining access rights to such information274US 4,525,780 AData General Corporation · 1985
- Emulation devices, systems and methods utilizing state machines263US 5,329,471 ATexas Instruments Incorporated · 1994
- Apparatus for non-conductively interconnecting integrated circuits using half capacitors233US 5,629,838 APolychip, Inc. · 1997
- Semiconductor dies and wafers and methods for making186US 5,059,899 AMicron Technology, Inc. · 1991