Die-to-die bypass mode for chiplet initialization, configuration, and communication

A die-to-die communication system, comprising:

• a transmitter configured on a transmitting die;
• a receiver configured on a receiving die;
• an interposer configured to communicate between the transmitting die and the receiving die at a test frequency that is equal or lower than the normal operating frequency of the system on a system on chip (SoC);
• and
• a plurality of pins configured on each of the transmitting die and the receiving die, wherein the plurality of pins are configured to communicate with the interposer at the test frequency.

A system on chip, comprising:

• a transmitting die;
• a receiving die;
• an interposer configured to communicate between the transmitting die and the receiving die at a test frequency that is at most one tenth of the normal operating frequency of the system on the system on chip (SoC);
• and
• a plurality of pins configured on each of the transmitting die and the receiving die, wherein the plurality of pins are configured to communicate a design for test (DFT) vector at the test frequency.