C23C 14/34
Sputtering
C23C14/34 (Sputtering) appears on 6,971 US grants and 8,788 published applications in this corpus.
Search patents in C23C- Granted patents
- 6,971
- Published applications
- 8,788
- Assignees
- 2,378
- Inventors
- 14,782
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 22 | 0 |
| 1978 | 16 | 0 |
| 1979 | 17 | 0 |
| 1980 | 14 | 0 |
| 1981 | 17 | 0 |
| 1982 | 10 | 0 |
| 1983 | 25 | 0 |
| 1984 | 26 | 0 |
| 1985 | 14 | 0 |
| 1986 | 20 | 0 |
| 1987 | 23 | 0 |
| 1988 | 22 | 0 |
| 1989 | 53 | 0 |
| 1990 | 53 | 0 |
| 1991 | 43 | 0 |
| 1992 | 54 | 0 |
| 1993 | 59 | 0 |
| 1994 | 63 | 0 |
| 1995 | 76 | 0 |
| 1996 | 75 | 0 |
| 1997 | 80 | 0 |
| 1998 | 98 | 0 |
| 1999 | 98 | 0 |
| 2000 | 174 | 0 |
| 2001 | 161 | 62 |
| 2002 | 193 | 189 |
| 2003 | 145 | 173 |
| 2004 | 163 | 226 |
| 2005 | 97 | 224 |
| 2006 | 72 | 252 |
| 2007 | 74 | 277 |
| 2008 | 74 | 236 |
| 2009 | 97 | 345 |
| 2010 | 147 | 299 |
| 2011 | 155 | 393 |
| 2012 | 169 | 405 |
| 2013 | 223 | 418 |
| 2014 | 258 | 475 |
| 2015 | 298 | 515 |
| 2016 | 302 | 463 |
| 2017 | 377 | 489 |
| 2018 | 341 | 436 |
| 2019 | 336 | 403 |
| 2020 | 351 | 473 |
| 2021 | 296 | 431 |
| 2022 | 316 | 433 |
| 2023 | 329 | 382 |
| 2024 | 326 | 340 |
| 2025 | 328 | 256 |
| 2026 | 183 | 193 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- C23C 14/3407Cathode assembly for sputtering apparatus2,789
- C23C 14/35By application of a magnetic field2,398
- C23C 14/3435Applying energy to the substrate during sputtering634
- C23C 14/3464Using more than one target570
- C23C 14/3485Using pulsed power to the target270
- C23C 14/46By ion beam produced by an external ion source254
- C23C 14/3492Variation of parameters during sputtering244
- C23C 14/3471Introduction of auxiliary energy into the plasma106
All 9 subgroupsShow fewer
Recent patents
- Coated cutting tool with an alternating layer composition6 Oct 2026US 12,752,344 B2Walter AG
- Shutter disc for a semiconductor processing tool6 Oct 2026US 12,753,488 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Coating module with improved cathode arrangement6 Oct 2026US 12,753,489 B2Singulus Technologies AG
- Method for forming robust hydrophobic surfaces on steel workpiece6 Oct 2026US 12,753,490 B2Hong Kong Applied Science and Technology Research Institute Company Limited
- External cooling assembly for substrate support6 Oct 2026US 12,755,943 B2APPLIED Materials.Inc.
- Method for producing transparent conductive coatings for emi protection using hipims8 Oct 2026US 2026/0308745 A1Raytheon Company
- Productive coating process for a steel sheet and corresponding equipment8 Oct 2026US 2026/0308746 A1
- Wnix sputtering target8 Oct 2026US 2026/0308747 A1Plansee SE
- Thermally stable metallic glass films via steep compositional gradients8 Oct 2026US 2026/0308748 A1
- Sputtering System with a Plasma Monitoring Device and an Ion Source8 Oct 2026US 2026/0311978 A1Dah Young Vacuum Equipment Co., Ltd.
Most cited
By later US patents
- Method of coating slip rings555US 10,813,640 B2Ethicon, Inc. · 2020
- Physical vapor deposition methods428US 6,558,517 B2Micron Technology, Inc. · 2003
- Chemical vapor deposition method for depositing a high k dielectric film423US 6,884,475 B2Micron Technology, Inc. · 2005
- Method of forming a capacitor421US 7,052,584 B2Micron Technology, Inc. · 2006
- Methods of forming a capacitor420US 7,217,617 B2Micron Technology, Inc. · 2007