WNiX SPUTTERING TARGET
AssigneesPlansee Shanghai High Performance Material Ltd., Plansee SE
InventorsTHOMAS SCHERER, YONGYUE CAI, CHRISTIAN LINKE, HENNRIK SCHMIDT, YI SUN
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AssigneesPlansee Shanghai High Performance Material Ltd., Plansee SE
InventorsTHOMAS SCHERER, YONGYUE CAI, CHRISTIAN LINKE, HENNRIK SCHMIDT, YI SUN
Estimating the term…
A sputtering target is produced by powder metallurgy. The sputtering target is formed of tungsten (W), nickel (Ni) and one further metal X selected from group 5 or group 6 of the periodic table of elements, as well as inevitable impurities. The sputtering target has a two-phase microstructure, wherein one phase is pure W and the other phase is a mixed phase selected from the group of NiWX, NiW, NiX and mixtures thereof. There is also described a process for producing a WNiX sputtering target via the powder-metallurgical route.
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A sputtering target, produced by powder metallurgy, the sputtering target comprising:
A method for producing a WNiX sputtering target by a powder-metallurgical process, the method comprising:
Dependencies are inferred from the claim text.