C23C 14/3471
Introduction of auxiliary energy into the plasma
Official title: {Introduction of auxiliary energy into the plasma}
C23C14/3471 (Introduction of auxiliary energy into the plasma) appears on 106 US grants and 117 published applications in this corpus.
Search patents in C23C- Granted patents
- 106
- Published applications
- 117
- Assignees
- 86
- Inventors
- 332
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 5 | 0 |
| 2001 | 3 | 2 |
| 2002 | 5 | 7 |
| 2003 | 3 | 4 |
| 2004 | 6 | 3 |
| 2005 | 2 | 4 |
| 2006 | 1 | 3 |
| 2007 | 2 | 5 |
| 2008 | 2 | 3 |
| 2009 | 2 | 6 |
| 2010 | 5 | 4 |
| 2011 | 1 | 1 |
| 2012 | 1 | 4 |
| 2013 | 2 | 6 |
| 2014 | 0 | 6 |
| 2015 | 4 | 4 |
| 2016 | 4 | 2 |
| 2017 | 6 | 3 |
| 2018 | 5 | 5 |
| 2019 | 2 | 8 |
| 2020 | 4 | 5 |
| 2021 | 3 | 6 |
| 2022 | 6 | 9 |
| 2023 | 5 | 6 |
| 2024 | 4 | 4 |
| 2025 | 8 | 7 |
| 2026 | 3 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Oxide film preparation method26 May 2026US 12,637,754 B2Beijing Naura Microelectronics Equipment Co., Ltd.
- Sputtering targets, and related apparatuses and methods21 Apr 2026US 12,609,288 B1Seagate Technology LLC
- Method of manufacturing crystalline material from different materials10 Feb 2026US 12,548,756 B2Dyson Technology Limited
- Plasma processing tool and operating method thereof29 Jul 2025US 12,374,525 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multi-functional shutter disk for thin film deposition chamber1 Jul 2025US 12,344,929 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Plasma processing tool and operating method thereof23 Oct 2025US 2025/0329512 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Multi-functional shutter disk for thin film deposition chamber2 Oct 2025US 2025/0305115 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Growth Method of Highly Twinned SiGe Alloy on the Basal Plane of Trigonal Substrate Under Electron Beam Irradiation3 Jul 2025US 2025/0215552 A1United States of America as represented by the Administrator of NASA
- Sputtering apparatus5 Jun 2025US 2025/0183020 A1Samsung Display Co., Ltd.
- Methods to impart color and durable properties to substrates8 May 2025US 2025/0146118 A1Georgia Tech Research Corporation
Most cited
By later US patents
- Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals130US 6,429,120 B1Micron Technology, Inc. · 2002
- Method and apparatus for low pressure sputtering108US 5,830,330 ATokyo Electron Limited · 1998
- Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals88US 6,756,298 B2Micron Technology, Inc. · 2004
- Multiple step ionized metal plasma deposition process for conformal step coverage75US 6,080,285 AAPPLIED Materials.Inc. · 2000
- Thin film forming apparatus using laser69US 5,622,567 AMitsubishi Denki Kabushiki Kaisha · 1997