C23C 14/3407
Cathode assembly for sputtering apparatus
Official title: {Cathode assembly for sputtering apparatus, e.g. Target}
C23C14/3407 (Cathode assembly for sputtering apparatus) appears on 2,789 US grants and 3,424 published applications in this corpus.
Search patents in C23C- Granted patents
- 2,789
- Published applications
- 3,424
- Assignees
- 938
- Inventors
- 5,530
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 5 | 0 |
| 1980 | 6 | 0 |
| 1981 | 5 | 0 |
| 1982 | 4 | 0 |
| 1983 | 10 | 0 |
| 1984 | 10 | 0 |
| 1985 | 4 | 0 |
| 1986 | 10 | 0 |
| 1987 | 6 | 0 |
| 1988 | 9 | 0 |
| 1989 | 22 | 0 |
| 1990 | 19 | 0 |
| 1991 | 24 | 0 |
| 1992 | 28 | 0 |
| 1993 | 39 | 0 |
| 1994 | 35 | 0 |
| 1995 | 49 | 0 |
| 1996 | 40 | 0 |
| 1997 | 36 | 0 |
| 1998 | 47 | 0 |
| 1999 | 50 | 0 |
| 2000 | 69 | 0 |
| 2001 | 67 | 27 |
| 2002 | 74 | 103 |
| 2003 | 79 | 75 |
| 2004 | 84 | 124 |
| 2005 | 48 | 110 |
| 2006 | 37 | 125 |
| 2007 | 28 | 140 |
| 2008 | 39 | 125 |
| 2009 | 60 | 189 |
| 2010 | 78 | 135 |
| 2011 | 79 | 182 |
| 2012 | 89 | 178 |
| 2013 | 99 | 191 |
| 2014 | 103 | 178 |
| 2015 | 129 | 162 |
| 2016 | 120 | 160 |
| 2017 | 128 | 152 |
| 2018 | 137 | 133 |
| 2019 | 106 | 124 |
| 2020 | 116 | 155 |
| 2021 | 101 | 138 |
| 2022 | 96 | 127 |
| 2023 | 110 | 106 |
| 2024 | 92 | 117 |
| 2025 | 97 | 100 |
| 2026 | 57 | 68 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Coating module with improved cathode arrangement6 Oct 2026US 12,753,489 B2Singulus Technologies AG
- Tubular sputter cathode29 Sep 2026US 12,747,491 B2BüHler Alzenau GmbH
- Cooking utensil22 Sep 2026US 12,740,667 B2Zhejiang Shintown Industry Co., Ltd
- Metal-Si based powder, method for producing same, metal-Si based sintered body, sputtering target, and metal-Si based thin film manufacturing method15 Sep 2026US 12,734,577 B2Tosoh Corporation
- Methods of making nanopowders, nanoceramic materials and nanoceramic components15 Sep 2026US 12,735,363 B2APPLIED Materials.Inc.
- Wnix sputtering target8 Oct 2026US 2026/0308747 A1Plansee SE
- Sputtering System with a Plasma Monitoring Device and an Ion Source8 Oct 2026US 2026/0311978 A1Dah Young Vacuum Equipment Co., Ltd.
- Al-sc alloys and sputtering targets and processes for consolidating1 Oct 2026US 2026/0297723 A1Materion Corporation
- Molybdenum target and method for producing the same1 Oct 2026US 2026/0297724 A1Ulvac, Inc.
- In situ and tunable deposition of a film1 Oct 2026US 2026/0297727 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Process kit and target for substrate processing chamber379US 9,127,362 B2APPLIED Materials.Inc. · 2015
- Magnetron sputtering apparatus and process326US 4,851,095 AOptical Coating Laboratory, Inc. · 1989
- Endocurietherapy293US 5,342,283 A1994
- Method of making an analyte sensor280US 7,882,611 B2Medtronic MiniMed, Inc. · 2011
- Spark eliminating sputtering target and method for using and making same238US 5,922,176 ADonnelly Corporation · 1999