Al-sc alloys and sputtering targets and processes for consolidating
AssigneeMaterion Corporation
InventorsQi ZENG, Katharine S. GARDINIER, David Peter VANHEERDEN, Jens WAGNER
Life of this patent
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Abstract
A process for producing an aluminum-scandium alloy sputtering target, the process comprising: atomizing ScxAl1-x to form a powder, wherein x ranges from 0.05 and 0.5; and consolidating the powder to form a target having a microstructure characterized by an average grain size of at most 50 microns. An aluminum-scandium alloy sputtering target comprising one or more Al—Sc intermetallic phases including Al—Sc intermetallic grains, wherein an average Al—Sc intermetallic grain size is at most 50 microns.
Claims20
A process for producing an aluminum-scandium alloy sputtering target, the process comprising:
- atomizing ScxAl1-x to form a powder, wherein x ranges from 0.05 to 0.5;
- and
- consolidating the powder to form a target having a microstructure characterized by an average grain size of at most 50 microns.
An aluminum-scandium alloy sputtering target comprising one or more Al—Sc intermetallic phases including Al—Sc intermetallic grains, wherein an average Al—Sc intermetallic grain size is at most 50 microns.
A process for producing an aluminum-scandium alloy sputtering target, the process comprising:
- atomizing ScxAl1-x to form a powder, wherein x ranges from 0.25 to 0.45;
- and
- consolidating the powder to form a target having a microstructure characterized by an average grain size of at most 50 microns, wherein consolidating includes heating from 900° C. to 1200° C. under pressure by at least one of spark plasma sintering, ultra-high pressure sintering, hot pressing, inert gas hot pressing, and vacuum hot pressing.
Dependencies are inferred from the claim text.