B81C 2201/0163
Controlling internal stress of deposited layers
B81C2201/0163 (Controlling internal stress of deposited layers) appears on 257 US grants and 269 published applications in this corpus.
Search patents in B81C- Granted patents
- 257
- Published applications
- 269
- Assignees
- 139
- Inventors
- 537
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 8 | 2 |
| 2002 | 6 | 11 |
| 2003 | 8 | 14 |
| 2004 | 12 | 15 |
| 2005 | 10 | 8 |
| 2006 | 10 | 9 |
| 2007 | 4 | 9 |
| 2008 | 7 | 4 |
| 2009 | 11 | 8 |
| 2010 | 6 | 9 |
| 2011 | 5 | 19 |
| 2012 | 9 | 15 |
| 2013 | 6 | 10 |
| 2014 | 11 | 11 |
| 2015 | 13 | 10 |
| 2016 | 13 | 25 |
| 2017 | 20 | 18 |
| 2018 | 24 | 15 |
| 2019 | 11 | 9 |
| 2020 | 12 | 7 |
| 2021 | 9 | 11 |
| 2022 | 7 | 5 |
| 2023 | 7 | 11 |
| 2024 | 5 | 6 |
| 2025 | 7 | 4 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81C 2201/0167By adding further layers of materials having complementary strains, i.e. compressive orIndexing code142
- B81C 2201/017Methods for controlling internal stress of deposited layers not provided for inIndexing code114
- B81C 2201/0169By post-annealingIndexing code29
- B81C 2201/0164By doping the layerIndexing code27
- B81C 2201/0166By ion implantationIndexing code9
Recent patents
- MEMS structure including a buried cavity with antistiction protuberances, and manufacturing methods thereof6 Oct 2026US 12,753,067 B2STMicroelectronics S,r.l.
- Mechanically coupled piezoelectric mems microphone25 Aug 2026US 12,715,759 B2Skyworks Solutions, Inc.
- Pressure sensor and manufacturing method for the same7 Apr 2026US 12,596,043 B2InvenSense, Inc.
- Piezoelectric MEMS microphone with spring region30 Dec 2025US 12,513,470 B2Skyworks Solutions, Inc.
- Mems platform for thin film nanomechanics characterization11 Nov 2025US 12,469,673 B2Carnegie Mellon University
- Mems device with compensation of the mechanical stress and related manufacturing process4 Jun 2026US 2026/0152384 A1STMicroelectronics International N. V.
- Forming a Bonded Interface Using Plasma-Activated Surfaces9 Apr 2026US 2026/0097953 A1Quantum Valley Ideas Laboratories
- MEMS Resonator9 Apr 2026US 2026/0100692 A1SiTime Corporation
- Method of manufacturing a layered structure for a mems apparatus and mems apparatus having such a layered structure26 Feb 2026US 2026/0054980 A1OQmented GmbH
- Monolithic Microelectromechanical Systems Based Spatial Light Modulators Including Ribbon-Type Modulators23 Oct 2025US 2025/0326629 A1Silicon Light Machines Corporation
Most cited
By later US patents
- Method of manufacturing an X-ray exposure mask and device for controlling the internal stress of thin films246US 5,188,706 AKabushiki Kaisha Toshiba · 1993
- Thin film-structure and a method for producing the same240US 6,759,261 B2Tokyo Institute of Technology · 2004
- Adjusting operating characteristics of micromachined torsional oscillators132US 5,969,465 AXROS, Inc. · 1999
- Method of fabrication of an infrared radiation detector and infrared detector device104US 6,194,722 B1Interuniversitair Micro-Elektronica Centrum (IMEC vzw) · 2001
- Process for the production of accelerometers using silicon on insulator technology78US 5,576,250 ACommissariat A L' Energie Atomique · 1996