B81C 2201/017
Methods for controlling internal stress of deposited layers not provided for in
Official title: Methods for controlling internal stress of deposited layers not provided for in B81C2201/0164 - B81C2201/0169
B81C2201/017 (Methods for controlling internal stress of deposited layers not provided for in) appears on 114 US grants and 118 published applications in this corpus.
Search patents in B81C- Granted patents
- 114
- Published applications
- 118
- Assignees
- 48
- Inventors
- 174
- Latest grant
- 30 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 2 |
| 2002 | 1 | 1 |
| 2003 | 1 | 4 |
| 2004 | 2 | 3 |
| 2005 | 2 | 1 |
| 2006 | 2 | 2 |
| 2007 | 2 | 1 |
| 2008 | 2 | 1 |
| 2009 | 1 | 2 |
| 2010 | 1 | 3 |
| 2011 | 2 | 12 |
| 2012 | 5 | 4 |
| 2013 | 3 | 4 |
| 2014 | 6 | 7 |
| 2015 | 4 | 4 |
| 2016 | 11 | 19 |
| 2017 | 12 | 12 |
| 2018 | 17 | 13 |
| 2019 | 8 | 6 |
| 2020 | 8 | 6 |
| 2021 | 8 | 3 |
| 2022 | 3 | 2 |
| 2023 | 3 | 3 |
| 2024 | 2 | 2 |
| 2025 | 1 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Piezoelectric MEMS microphone with spring region30 Dec 2025US 12,513,470 B2Skyworks Solutions, Inc.
- Method and apparatus for controlling stress variation in a material layer formed via pulsed DC physical vapor deposition16 Apr 2024US 11,961,722 B2SPTS Technologies Limited
- MEMS device manufacturing method, MEMS device, and shutter apparatus using the same19 Mar 2024US 11,932,535 B2Sumitomo Precision Products Co., Ltd.
- MEMS process power1 Aug 2023US 11,716,906 B2QUALCOMM Technologies, Inc.
- Manufacturing method of semiconductor structure25 Jul 2023US 11,708,262 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Forming a Bonded Interface Using Plasma-Activated Surfaces9 Apr 2026US 2026/0097953 A1Quantum Valley Ideas Laboratories
- Spring Supported and Sealed MEMS Diaphragm Assembly4 Apr 2024US 2024/0109770 A1Knowles Electronics, LLC
- Methods and apparatus for micro-electro-mechanical systems (mems) devices29 Feb 2024US 2024/0067519 A1
- Mems process power28 Dec 2023US 2023/0422623 A1QUALCOMM Technologies, Inc.
- Piezoelectric mems microphone with spring region6 Apr 2023US 2023/0105699 A1Skyworks Solutions, Inc.
Most cited
By later US patents
- Method of manufacturing an X-ray exposure mask and device for controlling the internal stress of thin films246US 5,188,706 AKabushiki Kaisha Toshiba · 1993
- Method of fabrication of an infrared radiation detector and infrared detector device104US 6,194,722 B1Interuniversitair Micro-Elektronica Centrum (IMEC vzw) · 2001
- Semiconductor sensor having suspended thin-film structure and method for fabricating thin-film structure body72US 5,922,212 ANippondenso Co., Ltd. · 1999
- Methods for producing MEMS with protective coatings using multi-component sacrificial layers62US 7,450,295 B2QUALCOMM MEMS Technologies, Inc. · 2008
- Planar cavity MEMS and related structures, methods of manufacture and design structures48US 8,921,144 B2International Business Machines Corporation · 2014