B81C 2201/0167
By adding further layers of materials having complementary strains, i.e. compressive or
Official title: by adding further layers of materials having complementary strains, i.e. compressive or tensile strain
B81C2201/0167 (By adding further layers of materials having complementary strains, i.e. compressive or) appears on 142 US grants and 150 published applications in this corpus.
Search patents in B81C- Granted patents
- 142
- Published applications
- 150
- Assignees
- 74
- Inventors
- 277
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 5 |
| 2003 | 3 | 7 |
| 2004 | 9 | 10 |
| 2005 | 5 | 6 |
| 2006 | 8 | 7 |
| 2007 | 2 | 7 |
| 2008 | 4 | 3 |
| 2009 | 9 | 5 |
| 2010 | 5 | 5 |
| 2011 | 2 | 14 |
| 2012 | 4 | 10 |
| 2013 | 4 | 6 |
| 2014 | 7 | 4 |
| 2015 | 8 | 3 |
| 2016 | 6 | 16 |
| 2017 | 11 | 9 |
| 2018 | 14 | 11 |
| 2019 | 8 | 6 |
| 2020 | 7 | 3 |
| 2021 | 7 | 4 |
| 2022 | 2 | 1 |
| 2023 | 3 | 4 |
| 2024 | 1 | 2 |
| 2025 | 2 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Microphone device with single crystal piezoelectric film and method of forming the same10 Oct 2023US 11,785,852 B2Vanguard International Semiconductor Singapore Pte. Ltd.
- Mems device with compensation of the mechanical stress and related manufacturing process4 Jun 2026US 2026/0152384 A1STMicroelectronics International N. V.
- Methods and apparatus for electronic device packaging9 Oct 2025US 2025/0313454 A1
- Process for manufacturing a three-dimensional structure in bending12 Dec 2024US 2024/0411057 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Method for manufacturing mirror device4 Jan 2024US 2024/0002219 A1Hamamatsu Photonics K.K.
- Pressure sensor and manufacturing method for the same21 Sep 2023US 2023/0296461 A1InvenSense, Inc.
Most cited
By later US patents
- Thin film-structure and a method for producing the same240US 6,759,261 B2Tokyo Institute of Technology · 2004
- Adjusting operating characteristics of micromachined torsional oscillators132US 5,969,465 AXROS, Inc. · 1999
- Semiconductor sensor having suspended thin-film structure and method for fabricating thin-film structure body72US 5,922,212 ANippondenso Co., Ltd. · 1999
- Micromachined electrostatic actuator with air gap59US 6,236,491 B1Mcnc · 2001
- Method of controlling stress in a film50US 5,913,125 AInternational Business Machines Corporation · 1999