B81C 2201/0169
By post-annealing
Official title: by post-annealing
B81C2201/0169 (By post-annealing) appears on 29 US grants and 35 published applications in this corpus.
Search patents in B81C- Granted patents
- 29
- Published applications
- 35
- Assignees
- 35
- Inventors
- 129
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 0 |
| 2002 | 2 | 2 |
| 2003 | 1 | 1 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 1 | 1 |
| 2008 | 1 | 0 |
| 2009 | 1 | 2 |
| 2010 | 1 | 1 |
| 2011 | 1 | 2 |
| 2012 | 0 | 2 |
| 2013 | 1 | 3 |
| 2014 | 2 | 1 |
| 2015 | 2 | 4 |
| 2016 | 1 | 3 |
| 2017 | 3 | 0 |
| 2018 | 1 | 1 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 1 | 3 |
| 2022 | 1 | 0 |
| 2023 | 0 | 3 |
| 2024 | 0 | 1 |
| 2025 | 2 | 0 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- MEMS structure including a buried cavity with antistiction protuberances, and manufacturing methods thereof6 Oct 2026US 12,753,067 B2STMicroelectronics S,r.l.
- Pressure sensor and manufacturing method for the same7 Apr 2026US 12,596,043 B2InvenSense, Inc.
- Mems platform for thin film nanomechanics characterization11 Nov 2025US 12,469,673 B2Carnegie Mellon University
- Method for fabricating a microfluidic device7 Oct 2025US 12,434,962 B2Imec Vzw
- MEMS structure and manufacturing method thereof22 Nov 2022US 11,505,454 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Forming a Bonded Interface Using Plasma-Activated Surfaces9 Apr 2026US 2026/0097953 A1Quantum Valley Ideas Laboratories
- Method of manufacturing a layered structure for a mems apparatus and mems apparatus having such a layered structure26 Feb 2026US 2026/0054980 A1OQmented GmbH
- Method for manufacturing mirror device4 Jan 2024US 2024/0002219 A1Hamamatsu Photonics K.K.
- Mems structure including a buried cavity with antistiction protuberances, and manufacturing methods thereof2 Nov 2023US 2023/0348258 A1STMicroelectronics S,r.l.
- Pressure sensor and manufacturing method for the same21 Sep 2023US 2023/0296461 A1InvenSense, Inc.
Most cited
By later US patents
- Reduced deformation of micromechanical devices through thermal stabilization39US 6,204,085 B1Texas Instruments Incorporated · 2001
- Micro-heater and airflow sensor using the same34US 6,450,025 B1Denso Corporation · 2002
- Fabrication of advanced silicon-based MEMS devices22US 7,160,752 B2DALSA Semiconductor Inc. · 2007
- Method of forming an electromechanical transducer device14US 8,513,042 B2Commissariat à L'éNergie Atomique Et Aux éNergies Alternatives (Cea) · 2013
- Method of making X-ray mask having reduced stress12US 5,677,090 AMitsubishi Denki Kabushiki Kaisha · 1997