Reduced deformation of micromechanical devices through thermal stabilization
AssigneeTexas Instruments Incorporated
InventorsMark H. Strumpell, Judith C. Frederic, Michael R. Douglass
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Abstract
A method and system of reducing the permanent accumulated deformation of a deflectable member of a micromechanical device through thermal stabilization. The accumulated deformation is due to the repeated bending or twisting of a flexible component of the micromechanical deice typically the repetitive deformation of a flexible hinge connecting a rigid member to substrate. After the device is fabricated, passivated (316), and packaged (322), the packaged device is baked (326) at a temperature of at least 120° C. A 150° C. bake for 12 to 16 hours is preferred. Lower temperatures required longer baking periods.
Claims18
A method of preventing the long-term accumulation of a permanent deflection in micromechanical device, said method comprising the steps of:
- fabricating said device;
- and
- baking said device at a temperature of at least 120° C.
A method of fabricating a micromechanical device, said method comprising the steps of:
- providing a substrate;
- forming a deflectable member supported by said substrate;
- and
- baking said deflectable member at a temperature of at least 120° C.
Dependencies are inferred from the claim text.