B81C 2201/0118
Processes for the planarization of structures
B81C2201/0118 (Processes for the planarization of structures) appears on 129 US grants and 166 published applications in this corpus.
Search patents in B81C- Granted patents
- 129
- Published applications
- 166
- Assignees
- 89
- Inventors
- 355
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 2 |
| 2002 | 3 | 2 |
| 2003 | 4 | 6 |
| 2004 | 3 | 2 |
| 2005 | 5 | 7 |
| 2006 | 1 | 6 |
| 2007 | 2 | 1 |
| 2008 | 2 | 5 |
| 2009 | 1 | 4 |
| 2010 | 4 | 3 |
| 2011 | 3 | 2 |
| 2012 | 3 | 5 |
| 2013 | 2 | 5 |
| 2014 | 7 | 5 |
| 2015 | 2 | 5 |
| 2016 | 5 | 8 |
| 2017 | 3 | 9 |
| 2018 | 12 | 10 |
| 2019 | 6 | 6 |
| 2020 | 12 | 16 |
| 2021 | 9 | 10 |
| 2022 | 6 | 4 |
| 2023 | 8 | 13 |
| 2024 | 7 | 12 |
| 2025 | 9 | 10 |
| 2026 | 5 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81C 2201/0125Blanket removalIndexing code68
- B81C 2201/0121Involving addition of material followed by removal of parts of said materialIndexing code29
- B81C 2201/0119Involving only addition of materials, i.e. additive planarizationIndexing code19
- B81C 2201/0126Processes for the planarization of structures not provided for in b81c2201/0119 -Indexing code13
- B81C 2201/0123Selective removalIndexing code11
- B81C 2201/0122Selective additionIndexing code6
Recent patents
- Composite spring structure to reinforce mechanical robustness of a mems device29 Sep 2026US 12,747,153 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for producing a micromechanical device comprising a cavity having a melt seal29 Sep 2026US 12,747,156 B2Robert Bosch GmbH
- Micro-electro-mechanical systems (MEMS) having vertical stops and anchor structures16 Jun 2026US 12,655,016 B2Lawrence Semiconductor Research Laboratory, Inc.
- Self-aligned acoustic hole formation in piezoelectrical MEMS microphone17 Feb 2026US 12,552,664 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Preventing electrode discontinuation on microdevice sidewall20 Jan 2026US 12,532,724 B2VueReal Inc.
- Micro-electro-mechanical systems (mems) having vertical stops and anchor structures10 Sep 2026US 2026/0265046 A1Lawrence Semiconductor Research Laboratory, Inc.
- Method for producing a microstructural element and microstructural element10 Sep 2026US 2026/0265049 A1Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Hermetically connected assembly18 Jun 2026US 2026/0166844 A1Schott AG
- Method for producing a micromechanical layer structure with high aspect ratio and micromechanical layer structure21 May 2026US 2026/0138867 A1
- Preventing electrode discontinuation on microdevice sidewall14 May 2026US 2026/0136906 A1VueReal Inc.
Most cited
By later US patents
- Chemical-mechanical polishing of recessed microelectromechanical devices181US 5,919,548 ASandia Corporation · 1999
- Continuous laminar fluid mixing in micro-electromechanical systems168US 6,520,197 B2The Regents of the University of California · 2003
- Use of chemical mechanical polishing in micromachining86US 5,804,084 ASandia Corporation · 1998
- Method of fabricating micro-electromechanical switches on CMOS compatible substrates83US 6,635,506 B2International Business Machines Corporation · 2003
- Methods for planarization and encapsulation of micromechanical devices in semiconductor processes81US 5,504,026 AAnalog Devices, Inc. · 1996