B81C 2201/0119
Involving only addition of materials, i.e. additive planarization
Official title: involving only addition of materials, i.e. additive planarization
B81C2201/0119 (Involving only addition of materials, i.e. additive planarization) appears on 19 US grants and 27 published applications in this corpus.
Search patents in B81C- Granted patents
- 19
- Published applications
- 27
- Assignees
- 18
- Inventors
- 56
- Latest grant
- 20 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 1 |
| 2003 | 1 | 1 |
| 2004 | 1 | 1 |
| 2005 | 2 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 1 | 1 |
| 2012 | 1 | 1 |
| 2013 | 1 | 2 |
| 2014 | 2 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 1 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 2 |
| 2022 | 1 | 0 |
| 2023 | 0 | 4 |
| 2024 | 2 | 0 |
| 2025 | 2 | 3 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Preventing electrode discontinuation on microdevice sidewall20 Jan 2026US 12,532,724 B2VueReal Inc.
- Method and system for fabricating a MEMS device cap11 Nov 2025US 12,466,726 B2InvenSense, Inc.
- Method and system for fabricating a MEMS device25 Mar 2025US 12,258,266 B2InvenSense, Inc.
- Method and system for fabricating a MEMS device31 Dec 2024US 12,180,069 B2InvenSense, Inc.
- Flattening apparatus, article manufacturing method, flattening method, and imprinting apparatus27 Feb 2024US 11,915,948 B2Canon Kabushiki Kaisha
- Hermetically connected assembly18 Jun 2026US 2026/0166844 A1Schott AG
- Preventing electrode discontinuation on microdevice sidewall14 May 2026US 2026/0136906 A1VueReal Inc.
- Method and system for fabricating a mems device cap11 Dec 2025US 2025/0376371 A1InvenSense, Inc.
- Method and system for fabricating a mems device8 May 2025US 2025/0145456 A1InvenSense, Inc.
- Method and system for fabricating a mems device6 Mar 2025US 2025/0074766 A1InvenSense, Inc.
Most cited
By later US patents
- Continuous laminar fluid mixing in micro-electromechanical systems168US 6,520,197 B2The Regents of the University of California · 2003
- Methods for planarization and encapsulation of micromechanical devices in semiconductor processes81US 5,504,026 AAnalog Devices, Inc. · 1996
- Contact planarization materials that generate no volatile byproducts or residue during curing56US 6,716,767 B2Brewer Science Inc. · 2004
- Epitaxial silicon CMOS-MEMS microphones and method for manufacturing14US 8,629,011 B2Robert Bosch GmbH · 2014
- MEMS element manufacturing method10US 6,838,304 B2Sony Corporation · 2005