US 6,716,767 B2 · Contact planarization materials that generate no volatile byproducts or residue during curing

Abstract

The present invention is directed towards planarization materials that produce little or no volatile byproducts during the hardening process when used in contact planarization processes. The materials can be hardened by photo-irradiation or by heat during the planarization process, and they include one or more types of monomers, oligomers, or mixtures thereof, an optional cross-linker, and an optional organic reactive solvents. The solvent, if used, is chemically reacted with the monomers or oligomers and thus becomes part of the polymer matrix during the curing process. These materials can be used for damascene, dual damascene, bi-layer, and multi-layer applications, microelectromechanical system (MEMS), packaging, optical devices, photonics, optoelectronics, microelectronics, and sensor devices fabrication.

Claims31

Dependent claims

A method of forming a microelectronic precursor, said method comprising the steps of:

providing a substrate having a surface and including a plurality of topography features on said surface;
forming a planarizing layer on said surface, wherein said planarizing layer comprises:
a monomer, an oligomer, or a mixture of a monomer and an oligomer;
and
a reactive solvent;
contacting the planarizing layer with a flat surface of an object for sufficient time and pressure to transfer the flatness of the flat surface to the planarizing layer.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/282,542Filed 28 Oct 2002 · us provisional application

Priority

31 Oct 2001

Published

US 2003/0129542 A110 Jul 2003

Granted

6 Apr 2004

Term ends

Not estimatedThe source records don’t support an estimate.

Classification14 codes

B81C 1/0046
Surface micromachining, i.e. structuring layers on the substrate: using stamping, e.g. imprinting
B81C 1/00611
Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity: processes for the planarisation of structures
C08G 59/68
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react…:…
C08L 63/00
Compositions of epoxy resins

Contact planarization materials that generate no volatile byproducts or residue during curing

Life of this patent

Contact planarization materials that generate no volatile byproducts or residue during curing

Life of this patent

Abstract

Claims31