US 2026/0166844 A1 · HERMETICALLY CONNECTED ASSEMBLY

Abstract

The invention relates to a hermetically connected assembly having a first substrate which is transparent in some regions and/or partly transparent for at least one wavelength range, a metal foil having a contact surface which adjoins a contact surface of the first substrate, and a laser joint line or a plurality of binding points for directly and indirectly joining the metal foil with the first substrate at or in the contact surfaces. The laser joint line or the plurality of binding points reach into the first substrate and into the metal foil, and the two joint partners are directly melted together. In the process, the metal foil is configured to be flexible in order to compensate for an unevenness of the contact surface of the first substrate.

Claims22

Dependent claims

A hermetically bonded assembly comprising:

a first substrate which is transparent in regions and/or to some degree to at least one wavelength range,
a metal foil,
wherein the metal foil is arranged with a contact face adjacent to a contact face of the first substrate,
a laser join line or a multitude of bond points for direct and immediate joining of the metal foil to the first substrate, at or in the contact areas,
wherein the laser join line or the multitude of bond points extends into the first substrate and into the metal foil and joins them together by direct melting,
wherein the metal foil is flexible in order to enable adaptation of the metal foil to the contact face of the first substrate.

3 more elements

Dependencies are inferred from the claim text.

Hermetically connected assembly

Life of this patent

Hermetically connected assembly

Life of this patent

Abstract

Claims22