Composite spring structure to reinforce mechanical robustness of a mems device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuei-Sung Chang, Shang-Ying Tsai, Wei-Jhih Mao
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Abstract
Various embodiments of the present disclosure are directed towards a semiconductor structure comprising a spring structure. A first substrate underlies a second substrate. The first and second substrates at least partially define a cavity. A microelectromechanical systems (MEMS) component is arranged in the cavity. The spring structure is disposed between a region of the second substrate and the MEMS component. The spring structure comprises a first layer and a second layer. The first layer continuously extends along a first vertical surface of the second layer.
Claims20
A semiconductor structure, comprising:
- a first substrate;
- a second substrate overlying the first substrate, wherein the first and second substrates at least partially define a cavity;
- a microelectromechanical systems (MEMS) component in the cavity;
- and
- a spring structure disposed between a region of the second substrate and the MEMS component, wherein the spring structure comprises a first layer having a first flexural strength and a second layer having a second flexural strength different from the first flexural strength, wherein the first layer continuously extends along a first vertical surface of the second layer, and wherein the spring structure has a third flexural strength greater than the first flexural strength and the second flexural strength.
A semiconductor structure, comprising:
- a first substrate overlying a base structure;
- a movable component over the base structure;
- and
- a suspension structure arranged between the movable component and a sidewall of the first substrate, wherein a crystal orientation of the suspension structure changes at least two times along a lateral distance between the sidewall of the first substrate and a sidewall of the movable component.
A semiconductor structure, comprising:
- a first substrate overlying a base structure;
- a movable component over the base structure;
- and
- a suspension structure arranged between the movable component and a sidewall of the first substrate, wherein the suspension structure comprises a first suspension layer and a second suspension layer, wherein in a top view, the first suspension layer comprises a first segment extending from the sidewall of the first substrate in a first direction and a second segment extending from the first segment in a second direction substantially orthogonal to the first direction, and wherein the second suspension layer comprises a plurality of third segments laterally offset from one another and interleaved with portions of the second segment along the second direction, wherein a length of an individual third segment of the plurality of third segments along the second direction is less than a lateral distance between adjacent segments in the plurality of third segments.
Dependencies are inferred from the claim text.