B81C 2201/0125
Blanket removal
Official title: Blanket removal, e.g. polishing
B81C2201/0125 (Blanket removal) appears on 68 US grants and 76 published applications in this corpus.
Search patents in B81C- Granted patents
- 68
- Published applications
- 76
- Assignees
- 34
- Inventors
- 135
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 1 |
| 2005 | 2 | 3 |
| 2006 | 0 | 1 |
| 2007 | 1 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 2 | 1 |
| 2011 | 1 | 1 |
| 2012 | 2 | 1 |
| 2013 | 1 | 2 |
| 2014 | 3 | 2 |
| 2015 | 0 | 2 |
| 2016 | 2 | 5 |
| 2017 | 2 | 3 |
| 2018 | 8 | 7 |
| 2019 | 1 | 5 |
| 2020 | 8 | 12 |
| 2021 | 7 | 6 |
| 2022 | 4 | 4 |
| 2023 | 7 | 5 |
| 2024 | 5 | 8 |
| 2025 | 6 | 3 |
| 2026 | 3 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composite spring structure to reinforce mechanical robustness of a mems device29 Sep 2026US 12,747,153 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for producing a micromechanical device comprising a cavity having a melt seal29 Sep 2026US 12,747,156 B2Robert Bosch GmbH
- Self-aligned acoustic hole formation in piezoelectrical MEMS microphone17 Feb 2026US 12,552,664 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Chip package18 Nov 2025US 12,473,197 B2Xintec Inc.
- Capacitive micromachined ultrasonic transducer and method of manufacturing the same8 Jul 2025US 12,350,710 B2Vermon
- Self-aligned acoustic hole formation in piezoelectrical mems microphone30 Oct 2025US 2025/0333297 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Self-aligned dielectric liner structure for protection in mems comb actuator18 Sep 2025US 2025/0293618 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices17 Jul 2025US 2025/0229292 A1Bfly Operations, Inc.
- Adaptive cavity thickness control for micromachined ultrasonic transducer devices19 Dec 2024US 2024/0416385 A1Bfly Operations, Inc.
- Mems device with a cap layer having gaps and method of manufacturing a mems device12 Dec 2024US 2024/0409398 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Chemical-mechanical polishing of recessed microelectromechanical devices181US 5,919,548 ASandia Corporation · 1999
- Use of chemical mechanical polishing in micromachining86US 5,804,084 ASandia Corporation · 1998
- Forming tool for forming a contoured microelectronic spring mold78US 6,780,001 B2FormFactor, Inc. · 2004
- Open cavity package using chip-embedding technology12US 9,663,357 B2Texas Instruments Incorporated · 2017
- MEMS element manufacturing method10US 6,838,304 B2Sony Corporation · 2005