Adaptive cavity thickness control for micromachined ultrasonic transducer devices
AssigneeBfly Operations, Inc.
InventorsLingyun Miao, Jianwei Liu, Keith G. Fife
Life of this patent
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AssigneeBfly Operations, Inc.
InventorsLingyun Miao, Jianwei Liu, Keith G. Fife
Estimating the term…
A method of forming an ultrasonic transducer device includes forming and patterning a film stack over a substrate, the film stack comprising a metal electrode layer and a chemical mechanical polishing (CMP) stop layer formed over the metal electrode layer; forming an insulation layer over the patterned film stack; planarizing the insulation layer to the CMP stop layer; measuring a remaining thickness of the CMP stop layer; and forming a membrane support layer over the patterned film stack, wherein the membrane support layer is formed at thickness dependent upon the measured remaining thickness of the CMP stop layer, such that a combined thickness of the CMP stop layer and the membrane support layer corresponds to a desired transducer cavity depth.
1-26. (canceled)
An ultrasound imaging device wherein:
Dependencies are inferred from the claim text.