B81C 2201/0126
Processes for the planarization of structures not provided for in b81c2201/0119 -
Official title: Processes for the planarization of structures not provided for in B81C2201/0119 - B81C2201/0125
B81C2201/0126 (Processes for the planarization of structures not provided for in b81c2201/0119 -) appears on 13 US grants and 16 published applications in this corpus.
Search patents in B81C- Granted patents
- 13
- Published applications
- 16
- Assignees
- 16
- Inventors
- 52
- Latest grant
- 5 Jul 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 1 |
| 2007 | 1 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 2 | 0 |
| 2017 | 0 | 3 |
| 2018 | 1 | 0 |
| 2019 | 2 | 0 |
| 2020 | 1 | 2 |
| 2021 | 1 | 1 |
| 2022 | 1 | 1 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing semiconductor structure and planarization process thereof5 Jul 2022US 11,377,347 B2United Microelectronics Corp.
- Actuator layer patterning with topography2 Feb 2021US 10,906,802 B2InvenSense, Inc.
- Actuator layer patterning with topography18 Aug 2020US 10,745,270 B2InvenSense, Inc.
- Method of encapsulating a microelectronic component7 May 2019US 10,280,075 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Method of reverse tone patterning19 Feb 2019US 10,211,051 B2Canon Kabushiki Kaisha
- Method of manufacturing a layered structure for a mems apparatus and mems apparatus having such a layered structure26 Feb 2026US 2026/0054980 A1OQmented GmbH
- Composition, its use and a process for cleaning substrates comprising cobalt and copper2 Oct 2025US 2025/0305152 A1BASF SE
- Atomic-smooth device with microstructure, and method for preparing same31 Aug 2023US 2023/0271825 A1
- Substrate processing system and substrate processing method16 Jun 2022US 2022/0184743 A1Tokyo Electron Limited
- Method for manufacturing semiconductor structure and planarization process thereof18 Nov 2021US 2021/0354983 A1United Microelectronics Corp.
Most cited
By later US patents
- Glass-type planar substrate, use thereof, and method for the production thereof25US 7,259,080 B2Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. · 2007
- Method of smoothing a trench sidewall after a deep trench silicon etch process16US 6,846,746 B2APPLIED Materials.Inc. · 2005
- Planarizing process for field emitter displays and other electron source applications10US 5,688,158 AFED Corporation · 1997
- Method for selective CMP of polysilicon3US 7,723,234 B2Clarkson University · 2010
- Actuator layer patterning with topography1US 10,745,270 B2InvenSense, Inc. · 2020