Glass-type planar substrate, use thereof, and method for the production thereof

A method for structuring a planar substrate composed of a glasslike material,

• characterized by a combination of the following methods steps:
• provision of a semiconductor planar substrate composed of a semiconductor material,
• reduction of the thickness of said semiconductor planar substrate inside at least one surface region of said semiconductor planar substrate in order to form a raised surface region in relation to said surface region of reduced thickness,
• structuring of said raised surface region of said semiconductor planar substrate by means of local mechanical removal of material in order to place impressions inside said raised surface region,
• structurally conform deposition of a metal layer onto said structured, raised surface region,
• joining said structured, metallized surface with said glasslike planar substrate in such a manner that said glasslike planar substrate at least partially covers said surface region of reduced thickness,
• tempering said joined planar substrates in such a manner that in a first tempering phase, which is conducted under vacuum conditions, said glasslike planar substrate covering said surface region of reduced thickness forms a fluid-tight bond with said surface region of reduced thickness, with said planar substrate covering said impressions under vacuum conditions in a fluid-tight manner, and that in a second tempering phase, at least partial areas of said glasslike material flow into said impressions of said structured, metallized surface of said semiconductor planar substrate.