Method of encapsulating a microelectronic component
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorPatrice Rey
Life of this patent
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Abstract
A method for encapsulation of microelectronic components includes making a portion of sacrificial material on a front face of a first substrate in which the component is to be made. The method then includes making a cover encapsulating the portion of sacrificial material, and making the component by etching the first substrate from its back face. The etching is such that part of the component faces the portion of the sacrificial material, and such that the portion of sacrificial material is accessible from a back face of the component. The method then includes eliminating the portion of the sacrificial material by etching from the back face of the component, and securing the back face of the component to a second substrate.
Claims11
A method for encapsulation of at least one microelectronic component, comprising:
- making at least one portion of sacrificial material on a front face of a first substrate in which the microelectronic component is to be made, the first substrate being a single layer of semiconductor, then
- making at least one cover encapsulating at least the portion of sacrificial material, then
- making the microelectronic component by etching the first substrate from a back face of the first substrate, such that at least part of the microelectronic component is arranged to face the portion of sacrificial material and such that the portion of sacrificial material is accessible from a back face of the microelectronic component, then
- eliminating the portion of sacrificial material by etching from the back face of the microelectronic component, and then
- securing the back face of the microelectronic component to a second substrate,
- wherein the making of the microelectronic component further includes etching the first substrate to form, during said etching, at least one mobile element and at least one trench passing through an entire thickness of the first substrate, delimiting said mobile element and forming an access to the portion of sacrificial material from the back face of the microelectronic component.
Dependencies are inferred from the claim text.