B81C 2201/0123
Selective removal
B81C2201/0123 (Selective removal) appears on 11 US grants and 21 published applications in this corpus.
Search patents in B81C- Granted patents
- 11
- Published applications
- 21
- Assignees
- 21
- Inventors
- 61
- Latest grant
- 5 Jul 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 0 |
| 2003 | 1 | 1 |
| 2004 | 0 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 2 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 0 |
| 2015 | 0 | 2 |
| 2016 | 2 | 3 |
| 2017 | 0 | 1 |
| 2018 | 2 | 2 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 1 | 1 |
| 2023 | 0 | 1 |
| 2024 | 0 | 3 |
| 2025 | 0 | 1 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing semiconductor structure and planarization process thereof5 Jul 2022US 11,377,347 B2United Microelectronics Corp.
- Manufacturing method of semiconductor device and semiconductor manufacturing apparatus26 Jun 2018US 10,008,390 B2Toshiba Memory Corporation
- Electronic device using MEMS technology13 Mar 2018US 9,914,637 B2Kabushiki Kaisha Toshiba
- Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (CMP) of III-V material in the presence of a CMP composition comprising a specific non-ionic surfactant16 Aug 2016US 9,416,298 B2BASF SE
- Method for manufacturing a structured surface12 Jan 2016US 9,233,843 B2Robert Bosch GmbH
- Mems microphone and method for manufacturing the same29 Jan 2026US 2026/0028220 A1United Microelectronics Corp.
- Micro-electro-mechanical device having contact pads that are protected against humidity and manufacturing process thereof8 May 2025US 2025/0145453 A1STMicroelectronics International N. V.
- Mems device with membrane and upright nanostructures1 Aug 2024US 2024/0253976 A1Infineon Technologies AG
- Mems device with membrane comprising laser structured nanostructures and method for manufacturing same1 Aug 2024US 2024/0253977 A1Infineon Technologies AG
- Self-aligned air gap formation in microelectronics packages28 Mar 2024US 2024/0101413 A1
Most cited
By later US patents
- Global planarization method7US 6,884,729 B2Cabot Microelectronics Corporation · 2005
- Structures using chemo-mechanical polishing and chemically-selective endpoint detection2US 6,545,299 B1The Regents of the University of California · 2003
- Method for manufacturing semiconductor structure and planarization process thereof1US 11,377,347 B2United Microelectronics Corp. · 2022
- Method for etched cavity devices1US 8,709,848 B2Freescale Semiconductor, Inc. · 2014