B81C 2201/0121
Involving addition of material followed by removal of parts of said material
Official title: involving addition of material followed by removal of parts of said material, i.e. subtractive planarization
B81C2201/0121 (Involving addition of material followed by removal of parts of said material) appears on 29 US grants and 37 published applications in this corpus.
Search patents in B81C- Granted patents
- 29
- Published applications
- 37
- Assignees
- 22
- Inventors
- 61
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 1 |
| 2005 | 1 | 3 |
| 2006 | 1 | 2 |
| 2007 | 0 | 0 |
| 2008 | 2 | 0 |
| 2009 | 1 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 2 | 4 |
| 2016 | 1 | 4 |
| 2017 | 1 | 3 |
| 2018 | 5 | 4 |
| 2019 | 3 | 1 |
| 2020 | 6 | 1 |
| 2021 | 1 | 2 |
| 2022 | 1 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 2 |
| 2026 | 1 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Micro-electro-mechanical systems (MEMS) having vertical stops and anchor structures16 Jun 2026US 12,655,016 B2Lawrence Semiconductor Research Laboratory, Inc.
- Method for manufacturing semiconductor structure and planarization process thereof5 Jul 2022US 11,377,347 B2United Microelectronics Corp.
- Micro-electro-mechanical system (MEMS) structures and design structures9 Nov 2021US 11,167,980 B2International Business Machines Corporation
- Process for forming inkjet nozzle devices3 Nov 2020US 10,822,228 B2Memjet Technology Limited
- Method for forming a planarization structure13 Oct 2020US 10,804,112 B2STMicroelectronics (Crolles 2) SAS
- Micro-electro-mechanical systems (mems) having vertical stops and anchor structures10 Sep 2026US 2026/0265046 A1Lawrence Semiconductor Research Laboratory, Inc.
- Method for producing a microstructural element and microstructural element10 Sep 2026US 2026/0265049 A1Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Mems sensor arrangement and method for manufacturing a mems sensor arrangement5 Feb 2026US 2026/0035236 A1Infineon Technologies AG
- Micro-electro-mechanical systems (mems) having vertical stops and anchor structures12 Jun 2025US 2025/0187901 A1Lawrence Semiconductor Research Laboratory, Inc.
- Method For Manufacturing Vibration Device3 Apr 2025US 2025/0109014 A1Seiko Epson Corporation
Most cited
By later US patents
- Method for producing co-planar surface structures66US 6,284,560 B1Eastman Kodak Company · 2001
- Method for registering a deposited material with channel plate channels61US 6,911,611 B2Agilent Technologies, Inc. · 2005
- Method of fabricating semiconductor devices employing at least one modulation doped quantum well structure and one or more etch stop layers for accurate contact formation10US 7,101,724 B2Wireless MEMS, Inc. · 2006
- Head electrode region for a reliable metal-to-metal contact micro-relay MEMS switch7US 7,352,266 B2Wireless MEMS, Inc. · 2008
- Method of producing a device with a movable portion6US 7,396,740 B2Frauhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V. · 2008