Process for forming inkjet nozzle devices
AssigneeMemjet Technology Limited
InventorsAngus North, Ronan O'Reilly, Gregory McAvoy
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Abstract
A process for forming inkjet nozzle devices on a frontside surface of a wafer substrate. The process includes the steps of: (i) providing the wafer substrate having a plurality of etched holes defined in the frontside surface, each etched hole being filled with first and second polymers such that the second polymer is coplanar with the frontside surface; (ii) forming the inkjet nozzle devices on the frontside surface using MEMS fabrication steps; and (iii) removing the first and second polymers via oxidative ashing, wherein first and second polymers are different.
Claims12
A process for forming inkjet nozzle devices on a frontside surface of a wafer substrate, the process comprising the steps of:
- (i) providing the wafer substrate having a plurality of etched holes defined in the frontside surface, each etched hole being filled with first and second polymers such that the second polymer is coplanar with the frontside surface;
- (ii) forming the inkjet nozzle devices on the frontside surface using one or more MEMS fabrication steps;
- (iii) removing the first and second polymers via oxidative ashing,
- wherein the first and second polymers are different.
Dependencies are inferred from the claim text.