Mems sensor arrangement and method for manufacturing a mems sensor arrangement
AssigneeInfineon Technologies AG
InventorsChristian Bretthauer, Steffen Bieselt
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Abstract
In an embodiment a MEMS sensor arrangement includes a substrate, a pressure sensor structure and a sound transducer structure in a vertically stacked and mechanically coupled configuration, wherein the pressure sensor structure is arranged between the substrate and the sound transducer structure and a through-opening extending through the substrate and the pressure sensor structure and forming a sound-port for the sound transducer structure, wherein the sound transducer structure spans the through-opening, and wherein the pressure sensor structure comprises a pressure sensor element, which is in fluidic connection with the through-opening.
Claims22
A MEMS sensor arrangement comprising:
- a substrate, a pressure sensor structure and a sound transducer structure in a vertically stacked and mechanically coupled configuration,
- wherein the pressure sensor structure is arranged between the substrate and the sound transducer structure;
- and
- a through-opening extending through the substrate and the pressure sensor structure and forming a sound-port for the sound transducer structure,
- wherein the sound transducer structure spans the through-opening, and
- wherein the pressure sensor structure comprises a pressure sensor element, which is in fluidic connection with the through-opening.
Dependencies are inferred from the claim text.