Method For Manufacturing Vibration Device

Abstract

A method for manufacturing a vibration device includes: preparing a base including a semiconductor substrate having a first surface, on which a circuit element is formed, and a second surface, and a first insulating layer disposed on the first surface of the semiconductor substrate and covering the circuit element; forming a second insulating layer by depositing an insulator on a fifth surface of the first insulating layer on a side opposite to the semiconductor substrate; planarizing at least a part of a third surface of the second insulating layer on a side opposite to the base by polishing; forming a mount electrode on the polished third surface of the second insulating layer; and bonding a vibration element to the mount electrode.

Dependencies are inferred from the claim text.