B81C 1/00865
Multistep processes for the separation of wafers into individual elements
Official title: {Multistep processes for the separation of wafers into individual elements}
B81C1/00865 (Multistep processes for the separation of wafers into individual elements) appears on 314 US grants and 334 published applications in this corpus.
Search patents in B81C- Granted patents
- 314
- Published applications
- 334
- Assignees
- 158
- Inventors
- 660
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 6 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 4 | 4 |
| 2002 | 14 | 15 |
| 2003 | 10 | 14 |
| 2004 | 16 | 14 |
| 2005 | 15 | 31 |
| 2006 | 14 | 21 |
| 2007 | 13 | 18 |
| 2008 | 15 | 14 |
| 2009 | 10 | 12 |
| 2010 | 15 | 12 |
| 2011 | 12 | 11 |
| 2012 | 9 | 8 |
| 2013 | 7 | 10 |
| 2014 | 12 | 11 |
| 2015 | 14 | 21 |
| 2016 | 15 | 14 |
| 2017 | 17 | 16 |
| 2018 | 15 | 18 |
| 2019 | 15 | 14 |
| 2020 | 10 | 12 |
| 2021 | 9 | 11 |
| 2022 | 13 | 9 |
| 2023 | 5 | 6 |
| 2024 | 4 | 6 |
| 2025 | 8 | 5 |
| 2026 | 3 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81C 1/00896Temporary protection during separation into individual elements116
- B81C 1/00888Multistep processes involving only mechanical separation80
- B81C 1/00873Characterised by special arrangements of the devices, allowing an easier separation73
- B81C 1/00904Multistep processes for the separation of wafers into individual elements not provided66
- B81C 1/0088Separation allowing recovery of the substrate or a part of the substrate15
Recent patents
- Integrated dicing die bonding sheet and method for producing semiconductor device25 Aug 2026US 12,721,105 B2Dow Toray Co., Ltd.
- Through-substrate conductor support11 Aug 2026US 12,703,625 B2Texas Instruments Incorporated
- Method for manufacturing mirror device23 Jun 2026US 12,662,373 B2Hamamatsu Photonics K.K.
- Semiconductor devices and related methods23 Sep 2025US 12,421,105 B2Amkor Technology Singapore Holding Pte.Ltd.
- MEMS device2 Sep 2025US 12,404,168 B2Huawei Technologies Co., Ltd.
- Method for manufacturing a microelectromechanical component, and microelectromechanical component1 Oct 2026US 2026/0296882 A1
- Method for singulating a wafer and suitable device21 May 2026US 2026/0138869 A1Carl Zeiss SMT GmbH
- Mems pressure transducer wafer-level chip-scale package and method for producing the same14 May 2026US 2026/0132018 A1Infineon Technologies AG
- Polymer nanofiber environmental barrier structure30 Apr 2026US 2026/0116743 A1Infineon Technologies AG
- Deep trenches on microelectromechanical system wafers for stealth dicing30 Apr 2026US 2026/0116745 A1Lumentum Operations LLC
Most cited
By later US patents
- Semiconductor device including eutectic bonding portion and method for manufacturing the same314US 6,555,901 B1Denso Corporation · 2003
- Protection of microelectronic devices during packaging182US 6,335,224 B12002
- Methods and apparatuses for singulation of microelectromechanical systems164US 5,923,995 ANational Semiconductor Corporation · 1999
- Method for manufacturing a semiconductor acceleration sensor device157US 5,668,033 ANippondenso Co., Ltd. · 1997
- Pre-release plastic packaging of MEMS and IMEMS devices124US 6,379,988 B1Sandia Corporation · 2002