B81C 1/00904
Multistep processes for the separation of wafers into individual elements not provided
Official title: {Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896}
B81C1/00904 (Multistep processes for the separation of wafers into individual elements not provided) appears on 66 US grants and 78 published applications in this corpus.
Search patents in B81C- Granted patents
- 66
- Published applications
- 78
- Assignees
- 42
- Inventors
- 126
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 0 | 1 |
| 2002 | 1 | 1 |
| 2003 | 2 | 5 |
| 2004 | 2 | 3 |
| 2005 | 6 | 19 |
| 2006 | 3 | 1 |
| 2007 | 5 | 2 |
| 2008 | 2 | 2 |
| 2009 | 3 | 1 |
| 2010 | 2 | 2 |
| 2011 | 0 | 1 |
| 2012 | 2 | 1 |
| 2013 | 3 | 0 |
| 2014 | 1 | 2 |
| 2015 | 3 | 5 |
| 2016 | 2 | 2 |
| 2017 | 3 | 4 |
| 2018 | 4 | 3 |
| 2019 | 4 | 5 |
| 2020 | 3 | 3 |
| 2021 | 2 | 6 |
| 2022 | 7 | 2 |
| 2023 | 1 | 1 |
| 2024 | 2 | 3 |
| 2025 | 2 | 0 |
| 2026 | 1 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Method for manufacturing a microelectromechanical component, and microelectromechanical component1 Oct 2026US 2026/0296882 A1
- Polymer nanofiber environmental barrier structure30 Apr 2026US 2026/0116743 A1Infineon Technologies AG
- Methods for post-processing and for handling of mems chips26 Mar 2026US 2026/0084957 A1
- Method for manufacturing electronic device and electronic device24 Oct 2024US 2024/0355677 A1TDK Corporation
- Sensor device package and method for manufacturing the same4 Apr 2024US 2024/0109768 A1Advanced Semiconductor Engineering, Inc.
Most cited
By later US patents
- Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates101US 6,969,635 B2Reflectivity, INC · 2005
- Spatial light modulators with light blocking/absorbing areas96US 6,906,847 B2Reflectivity, INC · 2005
- Method for making a micromechanical device by using a sacrificial substrate72US 6,900,072 B2Reflectivity, INC · 2005
- Micromachined transducers and method of fabrication57US 8,329,053 B2Avago Technologies Wireless IP (Singapore) Pte. Ltd. · 2012
- Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates48US 7,198,982 B2Texas Instruments Incorporated · 2007