Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
AssigneeTexas Instruments Incorporated
InventorsSatyadev R. Patel, Andrew G. Huibers, Steve S. Chiang
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Abstract
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
Claims26
A method for making a plurality of spatial light modulators, comprising:
- providing a transparent wafer and a semiconductor wafer;
- forming a plurality of micromirrors within a plurality of rectangular micromirror arrays on the semiconductor wafer;
- bonding the transparent wafer and semiconductor wafer together with a spacer layer therebetween so as to form gaps in which the micromirrors of the micromirror arrays are disposed;
- wherein the bonding is performed by application of an adhesive, application of pressure to press the transparent wafer and semiconductor wafer together;
- and curing the adhesive so as to form a wafer assembly;
- and singulating the wafer assembly into individual spatial light modulators.
Dependencies are inferred from the claim text.